Simulating damage mechanics of electromigration and thermomigration
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their intera...
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| Format: | Article |
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Society for Computer Simulation International, San Diego, Ca., USA
2008
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| author | Shidong, Li Abdul Hamid, Mohd. F. Basaran, Cemal |
| author_facet | Shidong, Li Abdul Hamid, Mohd. F. Basaran, Cemal |
| author_sort | Shidong, Li |
| collection | ePrints |
| description | Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their interaction. In this paper, a model for EM and TM processes is proposed and has been implemented in a general purpose finite-element code. The governing equations utilized for the model include mass conservation, force equilibrium, heat transfer and electricity conduction. A damage evolution model based on thermodynamics is introduced to evaluate the degradation in solder joints subjected to high current densities and high temperature gradients. The simulation results are compared with experimental data to validate the model.
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| first_indexed | 2024-03-05T18:13:53Z |
| format | Article |
| id | utm.eprints-8602 |
| institution | Universiti Teknologi Malaysia - ePrints |
| last_indexed | 2024-03-05T18:13:53Z |
| publishDate | 2008 |
| publisher | Society for Computer Simulation International, San Diego, Ca., USA |
| record_format | dspace |
| spelling | utm.eprints-86022009-05-06T04:38:59Z http://eprints.utm.my/8602/ Simulating damage mechanics of electromigration and thermomigration Shidong, Li Abdul Hamid, Mohd. F. Basaran, Cemal TJ Mechanical engineering and machinery Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their interaction. In this paper, a model for EM and TM processes is proposed and has been implemented in a general purpose finite-element code. The governing equations utilized for the model include mass conservation, force equilibrium, heat transfer and electricity conduction. A damage evolution model based on thermodynamics is introduced to evaluate the degradation in solder joints subjected to high current densities and high temperature gradients. The simulation results are compared with experimental data to validate the model. Society for Computer Simulation International, San Diego, Ca., USA 2008 Article PeerReviewed Shidong, Li and Abdul Hamid, Mohd. F. and Basaran, Cemal (2008) Simulating damage mechanics of electromigration and thermomigration. Simulation: Transactions of The Society for Modelling and Simulation Int., 84 (8-9). pp. 391-401. ISSN 0037-5497 http://dx.doi.org/10.1177/0037549708094856 10.1177/0037549708094856 |
| spellingShingle | TJ Mechanical engineering and machinery Shidong, Li Abdul Hamid, Mohd. F. Basaran, Cemal Simulating damage mechanics of electromigration and thermomigration |
| title | Simulating damage mechanics of electromigration and thermomigration |
| title_full | Simulating damage mechanics of electromigration and thermomigration |
| title_fullStr | Simulating damage mechanics of electromigration and thermomigration |
| title_full_unstemmed | Simulating damage mechanics of electromigration and thermomigration |
| title_short | Simulating damage mechanics of electromigration and thermomigration |
| title_sort | simulating damage mechanics of electromigration and thermomigration |
| topic | TJ Mechanical engineering and machinery |
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