Framework to reduce cost scrapping and cost of assemble test capacity in semiconductor integrated circuit manufacturing
Semiconductor including integrated circuit (IC) is an expensive and complicated process. The trend of semiconductor packaging is going towards better performance with lower power consumption packages. Thus, the single-die packaging trend has evolved into multi-die packaging. The evolution of multi-...
| Hlavní autoři: | , , , |
|---|---|
| Médium: | Článek |
| Jazyk: | English |
| Vydáno: |
kansai university, japan
2020
|
| Témata: | |
| On-line přístup: | https://repo.uum.edu.my/id/eprint/28159/1/TRKU%2062%2017%202020%203625%203630.pdf |