Residual stress evaluation at the micrometer scale: Analysis of thin coatings by FIB milling and digital image correlation by Korsunsky, A, Sebastiani, M, Bemporad, E

“…The newly proposed approach involves incremental Focused Ion Beam (FIB) milling of annular trenches at material surface, combined with high resolution SEM imaging of a previously deposited marker pattern. Digital image correlation (DIC) analysis of the relative displacements between markers with respect to the undisturbed state provides a measure of strain relief. …”

Focused ion beam ring drilling for residual stress evaluation by Korsunsky, A, Sebastiani, M, Bemporad, E

“…Strain change was measured at sample surface via Digital Image Correlation analysis of SEM micrographs of a regular pattern of dots deposited on the sample surface prior to ring drilling. …”

Focused ion beam ring drilling for residual stress evaluation by Korsunsky, A, Sebastiani, M, Bemporad, E

“…Strain change was measured at sample surface via Digital Image Correlation analysis of SEM micrographs of a regular pattern of dots deposited on the sample surface prior to ring drilling. …”

Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging by Song, X, Yeap, K, Zhu, J, Belnoue, J, Sebastiani, M, Bemporad, E, Zeng, K, Korsunsky, A

“…Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. …”

A New Methodology For In-Situ Residual Stress Measurement In MEMS Structures by Sebastiani, M, Bemporad, E, Melone, G, Rizzi, L, Korsunsky, A

“…The newly proposed approach involves incremental focused ion beam (FIB) milling of annular trenches at material surface, combined with high resolution SEM imaging and Digital Image Correlation (DIC) analysis for the measurement of the strain relief over the surface of the remaining central pillar. …”

Focused ion beam four-slot milling for Poisson's ratio and residual stress evaluation at the micron scale by Sebastiani, M, Eberl, C, Bemporad, E, Korsunsky, A, Nix, W, Carassiti, F

“…A novel method is presented for the assessment of the Poisson's ratio and residual stress on the micron scale, based on focused ion beam (FIB) two-step four-slot micro-milling and in-situ digital image correlation (DIC) analysis of the induced relaxation strains at the specimen's surface. …”

Focused ion beam four-slot milling for Poisson's ratio and residual stress evaluation at the micron scale by Sebastiani, M, Eberl, C, Bemporad, E, Korsunsky, A, Nix, W, Carassiti, F

“…A novel method is presented for the assessment of the Poisson's ratio and residual stress on the micron scale, based on focused ion beam (FIB) two-step four-slot micro-milling and in-situ digital image correlation (DIC) analysis of the induced relaxation strains at the specimen's surface.The methodology has been fully validated through modelling and experiments on three different materials, namely, physical vapour deposition (PVD) chromium nitride (CrN), and as-deposited and annealed Cu thin films. …”

Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam by Song, X, Yeap, K, Zhu, J, Belnoue, J, Sebastiani, M, Bemporad, E, Zeng, K, Korsunsky, A

“…Either SEM or FIB imaging can be used to record sequences of images for strain change evaluation by Digital Image Correlation (DIC) analysis of micrographs. …”

A critical comparison between XRD and FIB residual stressmeasurement techniques in thin films by Bemporad, E, Brisotto, M, Depero, L, Gelfi, M, Korsunsky, A, Lunt, A, Sebastiani, M

“…However, it is subject to certain limitations: X-ray diffraction allows stress evaluation (i.e. its indirect deduction from the measured diffraction profile) only in case of crystalline materials, and the results may be subject to aberrations in the presence of texture or stress gradients often occurring in thin films.Recently, a new class of methods for residual stress evaluation has been proposed, based on incremental focused ion beam (fib) milling, combined with high-resolution in situ scanning electron microscopy (SEM) imaging and full field strain analysis by digital image correlation (DIC).The aim of the present paper is to explore in some detail the significance of the stress values obtained for the same coating by X-ray diffraction and focused ion beam milling, and to demonstrate that the analysis of residual stress depth gradients is possible by using FIB-DIC techniques. …”