Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection by Hu, Xiao, Yang, Ying, Chen, Zhong, Chan, Yan Cheong, Xu, Sha

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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Controlling Na diffusion by rational design of Si-based layered architectures by Kulish, Vadym V., Malyi, Oleksandr I., Ng, Man-Fai, Chen, Zhong, Manzhos, Sergei, Wu, Ping

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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Intrinsic stress in electroless nickel plating and its effect on reliability by Chen, Zhong., Yip, Tick Hon.

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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Fabrication of patterned CdS/TiO2 heterojunction by wettability template-assisted electrodeposition by Lai, Yuekun, Lin, Zequan, Chen, Zhong, Huang, Jianying, Lin, Changjian

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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Study of the interfaces between electroless nickel under bump metallization and lead-free solders by He, Min.

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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Scratch resistance of brittle thin films on compliant substrates by Wu, Linda Y. L., Chen, Zhong, Chwa, Edmund, Tham, Otto

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Magnetron sputtered TiO2 films on a stainless steel substrate : selective rutile phase formation and its tribological and anti-corrosion performance by Krishna, Dangeti Siva Rama, Sun, Yong, Chen, Zhong

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Fracture toughness measurement of thin films on compliant substrate using controlled buckling test by Chen, Zhong, Gan, Zhenghao

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction by He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Chemically active plasmas for deterministic assembly of nanocrystalline SiC film by Cheng, Q. J., Long, J. D., Chen, Zhong, Xu, Shuyan

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Nanoscale morphology for high hydrophobicity of a hard sol–gel thin film by Wu, Y. L., Zeng, X. T., Chen, Zhong

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate by Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test by Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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Adhesion enhancement of sol–gel coating on polycarbonate by heated impregnation treatment by Wu, Linda Y. L., Boon, L., Zeng, X. T., Chen, Zhong

Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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