Showing 1 - 14 results of 14 for search '"semiconductor materials"', query time: 0.09s Refine Results
  1. 1
    Stability study of non-volatile memory content under different temperature conditions

    Stability study of non-volatile memory content under different temperature conditions by Siow, Jia Wei

    Published 2021
    Subjects: “…Engineering::Materials::Microelectronics and semiconductor materials…”
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    Final Year Project (FYP)
  2. 2
    Characterization of read sensors in hard disk drives

    Characterization of read sensors in hard disk drives by Liew, Li Ting.

    Published 2010
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Final Year Project (FYP)
  3. 3
    De-layering of copper and low-k dielectrics for semiconductor devices failure analysis

    De-layering of copper and low-k dielectrics for semiconductor devices failure analysis by Ng, Mei Zhen.

    Published 2010
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Final Year Project (FYP)
  4. 4
    Solder joints morphology study on stacked die

    Solder joints morphology study on stacked die by Lee, Yi Xuan.

    Published 2011
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Final Year Project (FYP)
  5. 5
    Cobalt-doped zinc oxide dilute magnetic semiconductors for spintronics devices

    Cobalt-doped zinc oxide dilute magnetic semiconductors for spintronics devices by Liu, Qing

    Published 2011
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Thesis
  6. 6
    Graphene growth through segregation method

    Graphene growth through segregation method by Kristianto, Ronald.

    Published 2013
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Final Year Project (FYP)
  7. 7
    Investigation of interconnect layout on CU/Low-K TDDB reliability

    Investigation of interconnect layout on CU/Low-K TDDB reliability by Ong, Ran Xing

    Published 2015
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Thesis
  8. 8
    On-state reliability study of AlGaN/GaN high electron mobility transistor on silicon

    On-state reliability study of AlGaN/GaN high electron mobility transistor on silicon by Syaranamual, Govindo Joannesha

    Published 2018
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
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    Thesis
  9. 9
    Modeling of electromigration failure under pulsed current conditions in confined copper interconnect

    Modeling of electromigration failure under pulsed current conditions in confined copper interconnect by Lin, Jingyuan.

    Published 2010
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  10. 10
    Cu metallization and dielectric removal for failure analysis of ICs

    Cu metallization and dielectric removal for failure analysis of ICs by Siah, Yu Wen.

    Published 2012
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  11. 11
    Electrical characterization of copper-based nanowire

    Electrical characterization of copper-based nanowire by Pah, Hazel Pei Lin

    Published 2012
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  12. 12
    Electromigration reliability study on copper interconnects under pulsed current conditions

    Electromigration reliability study on copper interconnects under pulsed current conditions by Lim, Meng Keong

    Published 2015
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  13. 13
    A small step towards solving the global chip shortage problem – physical failure analysis

    A small step towards solving the global chip shortage problem – physical failure analysis by Tan, Yi Kai

    Published 2022
    Subjects: “…Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  14. 14
    Development of magnetic current imaging for the failure analysis of 3D package technology

    Development of magnetic current imaging for the failure analysis of 3D package technology by Kor, Katherine Hwee Boon.

    Published 2013
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials…”
    Get full text
    Thesis

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