Search Results - New York, N.Y. : McGraw-Hill, :: UTM Library Massive Scholar Tracking

1

Area array packaging processes : for BGA, Flip Chip, and CSP / by Gilleo, Ken

Published 2004
“…New York, N.Y. : McGraw-Hill,…”
2

Area array packaging materials : adhesives, pastes, and lead-free / by Gilleo, Ken

Published 2004
“…New York, N.Y. : McGraw-Hill,…”
3

Area array package design : techniques in high-density electronics / by Gilleo, Ken

Published 2004
“…New York, N.Y. : McGraw-Hill,…”