Synthesis and characterization of Palladium(Ii) and Nickel(Ii) complexes of schiff bases and the potential of the Palladium (Ii) complexes as catalysts for C-C bond formation / Amalina Mohd Tajuddin by Mohd Tajuddin, Amalina

“…This study reports the synthesis, characterization and catalytic activities of palladium(II) Schiff base complexes, both as homogeneous and MCM-41 supported heterogeneous catalysts for cross-coupling C-C bond formation reactions. …”
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Producing Technical Grade Glyphosate from NPMIDA and H2O2 with Palladium Catalyst Supported by Activated Carbon: an Evaluation of Reaction Mechanism and the Constant Rate of Reaction by Rahayuningsih, Edia, Bendiyasa, I Made, Arie S., Felix, Nuryono, Nuryono

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Electroless plating as surface finishing in electronic packaging by Mohamed Ariff, Azmah Hanim

“…In this article, focus is given to the three different types of electroless plating formulations used in electronic packaging that have been studied by previous researchers: electroless nickel, electroless palladium, and electroless gold.…”
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Effect of surface finish metallurgy on intermetallic compuands during soldering with tin-silver-copper solders by Ourdjini, Ali, Mohamed Ariff, Hanim, Idris, Siti Rabiatul Aisha

“…The focus of this paper is to present experimental results of a comprehensive study of the interfacial reactions during soldering of Sn-Ag-Cu lead-free solders on copper (Cu), immersion silver (ImAg), electroless nickel/ immersion gold (ENIG) and electroless nickel/ electroless palladium/ immersion gold (ENEPIG) surface finishes. …”