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Preparation Of Palladium Nanoparticles Stabilized By Cyclodextrins In Aqueous Solution And Their Activity For Hydrogenation Of Palm Oil
Published 2010“…Palladium (Pd) nanoparticles were prepared in aqueous solution with different cyclodextrins (CDs) as stabilizer and alcohols as reducing agent. …”
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2
Highly sensitive plastic optical fiber with palladium sensing layer for detection of hydrogen gas
Published 2016“…This paper reports an optical sensor using plastic optical fiber for the detection of hydrogen gas. A thin layer of palladium is used as the sensing layer to enhance the performance of the optical fiber sensor. …”
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3
Palladium (ii) complex bearing linear amino acid thiourea as homogenous catalyst in heck cross-coupling reaction
Published 2011Conference or Workshop Item -
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Supported palladium catalysis using a biguanide n-donor motif on mesoporous silica for suzuki-miyaura coupling reaction
Published 2013Conference or Workshop Item -
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Kenaf Cellulose Supported Highly Active Poly(Amidoxime) Palladium Complex as a Reusable Heterogeneous Catalyst For Allylic Arylation Reactions
Published 2016“…A highly active kenaf cellulose supported poly(amidoxime) palladium catalyst was synthesized and characterized with FTIR, UV-Vis, FESEM, XPS and TEM analyses. …”
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6
Synthesis of Kenaf Cellulose Supported Highly Active Poly(amidoxime) Palladium Complex and Its Application as a Reusable Catalyst for Allylic Arylation reactions
Published 2016“…A highly active kenaf cellulose supported poly(amidoxime) palladium catalyst was sythesized and the catalyst (65 mol ppm to 6.5 mol ppm) was found to promote efficiently allylic arylation of allylic ester with sodium tetraarylborates and arylboronic acids in ethanol at 60 °C temperature. …”
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7
Synthesis of precursor of anti-cancer drugs
Published 2004“…This reactive zinc was used for efficient transformation of ethyl 2-bromoacrylate into the corresponding organozinc compound, which was reacted with various aryl halides in the presence of palladium catalyst to give the corresponding cross-coupling products, ethyl 2-arylpropenoates, in high yields. …”
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8
Efficient cross-coupling reaction of functionalized alkyl bromides with aryl halides by using electrochemical method
Published 2004“…Reaction of the organozinc compounds thus prepared with various aryl iodides in the presence of 5 mol% of palladium catalyst gave the corresponding cross-coupling products in hick yields. …”
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9
Effect of mediator on preparation of highly reactive electrogenerated zinc and its use in cross coupling reaction
Published 2005“…Reaction of the organozinc compounds thus prepared with various aryl iodides in the presence of 5 mol% of palladium catalyst gave the corresponding cross-coupling products in high yields.…”
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10
Synthesis of composite thin-film polymer consisting of tungsten and zinc oxide as hydrogen gas detector
Published 2019“…A composite polymer consisting of polyaniline (PANI) was synthesised via oxidative polymerisation by varying concentrations of transitional metal oxides and the presence of a hydrogen dissociation catalyst, palladium (Pd). The metal oxides chosen for this study were tungsten oxide (WO3) and zinc oxide (ZnO). …”
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11
Effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders
Published 2013“…The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). …”
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New preparation method of highly reactive electrogenerated zinc and its use in cross-coupling reaction of functionalized organic bromides with aryl halides by using electrochemical...
Published 2005“…Reaction of the organozinc compounds thus prepared with various aryl iodides in the presence of 5 mol% of palladium catalyst gave the corresponding cross-coupling products in high yields. …”
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13
Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes
Published 2007“…Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. …”
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14
The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish
Published 2014“…Therefore, this study investigates the effect of nickel doping on Sn-3.0Ag-0.5Cu (SAC305) lead-free solders and electroless nickel (boron)/electroless palladium/immersion gold (EN(B)EPIG) surface finish. …”
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