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1
Advanced packaging solder paste
Published 2022“…This was done by gaining an in-depth understanding of the principles of Surface Mount Technology (SMT), the role of each component in the solder paste, the rheology performance of the paste and the factors that affect the performance of the paste. …”
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Final Year Project (FYP) -
2
Real time embedded personal navigation system
Published 2009“…The whole system will be based on Surface Mount Technology (SMT) for the development of the Printed Circuit Board (PCB) and it will be housed by a portable casing. …”
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Final Year Project (FYP) -
3
Step towards home-based robotic rehabilitation : an interface circuit for EEG : SEMG actuated orthosis
Published 2009“…It can be done by using wireless technology, or by changing the technology used in PCB (from THT to SMT), and many more. This project has produced a paper to the forthcoming International Conference in Advance Intelligent Mechatronics (AIM) 2009. …”
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Final Year Project (FYP)