Electrical stress and failure analysis of power semiconductor devices by Chee, Sean Nicholas

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Thermal modeling and characterization for power devices (IGBT) by Sulaiman Mohamed.

“…Temperature junction constraints in power semiconductor devices are one of the factors that can determine whether it would change in its operation or go into failure. …”
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Investigation of wide bandgap device (Silicon Carbide Metal Oxide Semiconductor Field Effect Transistor) by Chan, Matthew Nigel Zhen Yu

“…As such, with its rapid and wide-scale implications in modern power electronic systems, the durability and survivability of the power semiconductor device is highly crucial. As such, this dissertation presents the comprehensive study of the various failure mechanisms and contemporary protection measures of the SiC MOSFET. …”
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Multi-level diode clamped DC/AC inverter by Sia, Siow Hua.

“…Higher voltage rating of inverter can be achieved by connecting the power semiconductor devices in series. Among these series connection of power semiconductor devices, multilevel is one of the topology. …”
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Condition monitoring of IGBT by Thein, Myo

“…Power semiconductor devices play an important role in industrial applications. …”
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Development of compact sensor system for gate driver and control of a three phase power module by Aung, Htu Co

“…The sensor system includes a current sensor, based on the principle of a Rogowski coil, and an op-amp integrator circuit, which will act as a low pass filter, so that the device current of the embedded power semiconductor devices can be measured. Since the switched-mode currents will be measured, the dynamics of this current sensor are of vital importance.…”
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