Application of supercritical CO2 for wafer processing steps by Tse, Man Siu., Tay, Joo Hwa., Wong, Fook Sin.

“…Invention disclosures have been submitted to NTU for consideration. 1. Method of Forming Palladium Seeding nanoparticles and Film on Barrier Layer for Copper Metallization in Semiconductor Wafer Manufacturing Abstract A method for the deposition of noble metal nanoparticles or thin film such as the noble metal Palladium nanoparticles or thin film for example, over the barrier layer surface for the purposes of copper metallization in wafer manufacturing by supercritical chemical fluid deposition. …”
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