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1
Semiconductor/Polymer/Semiconductor double junction thin film for photovoltaic application
Published 2011“…Designers layer semiconductor materials with differing band gap energies to result in higher conversion efficiencies. …”
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Proceeding Paper -
2
Study of the electrical properties of radiation hard devices based on III-V materials
Published 2012“…Most electronic devices nowadays are fabricated using semiconductor materials. GaAs is preferred over silicon to produce devices due to it being more resistant to defects due to radiation. …”
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Monograph -
3
Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
Published 2014“…-WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. …”
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Proceeding Paper -
4
Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
Published 2014“…-WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. …”
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