Study on low temperature bonding solders for in-50 atomic % Sn/Cu joint for 3-D integrated circuit (IC) by Feng, Famin

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Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / by 529862 Li, Er-Ping

A Study of Advancing Ultralow-Power 3D Integrated Circuits with TEI-LP Technology and AI-Enhanced PID Autotuning by Sangmin Jeon, Hyunseok Kwak, Woojoo Lee

“…The 3D integrated circuit (3D-IC) is garnering significant attention from academia and industry as a key technology leading the post-Moore era, offering new levels of efficiency, power, performance, and form-factor advantages to the semiconductor industry. …”
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Electrical Coupling and Simulation of Monolithic 3D Logic Circuits and Static Random Access Memory by Tae Jun Ahn, Bum Ho Choi, Sung Kyu Lim, Yun Seop Yu

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Interaction of advanced micro/nano electronics and materials with marine environment by Maoqiu Pu, Maoqiu Pu, Zhiyuan Zhu, Jing Guo

Subjects: “…3D integrated circuit…”
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NoCs in Heterogeneous 3D SoCs: Co-Design of Routing Strategies and Microarchitectures by Jan Moritz Joseph, Lennart Bamberg, Dominik Ermel, Behnam Razi Perjikolaei, Anna Drewes, Alberto Garcia-Ortiz, Thilo Pionteck

Subjects: “…3D integrated circuits…”
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Multi-Tier 3D IC Physical Design with Analytical Quadratic Partitioning Algorithm Using 2D P&R Tool by Azwad Tamir, Milad Salem, Jie Lin, Qutaiba Alasad, Jiann-shiun Yuan

Subjects: “…3D integrated circuit…”
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Circuit Simulation Considering Electrical Coupling in Monolithic 3D Logics with Junctionless FETs by Tae Jun Ahn, Yun Seop Yu

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Thermal Modeling and Device Noise Properties of Three-Dimensional-SOI Technology by Chen, Tze Wee, Chun, Jung-Hoon, Lu, Yi-Chang, Navid, Reza, Wang, Wei, Chen, Chang-Lee, Dutton, Robert W.

Subjects: “…three-dimensional (3-D) integrated circuit…”
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Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing by Mingkun Yang, Yongjun Huo, Xiuchen Zhao, Yuzheng Guo, Yingxia Liu

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CiM3D: Comparator-in-Memory Designs Using Monolithic 3-D Technology for Accelerating Data-Intensive Applications by Akshay Krishna Ramanathan, Srivatsa Srinivasa Rangachar, Hariram Thirucherai Govindarajan, Je-Min Hung, Chun-Ying Lee, Cheng-Xin Xue, Sheng-Po Huang, Fu-Kuo Hsueh, Chang-Hong Shen, Jia-Min Shieh, Wen-Kuan Yeh, Mon-Shu Ho, Jack Sampson, Meng-Fan Chang, Vijaykrishnan Narayanan

Subjects: “…monolithic (sequential) 3-D integrated circuit (M3D-IC)…”
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Investigation of Channel Doping Concentration and Reverse Boron Penetration on P-Type Pi-Gate Poly-Si Junctionless Accumulation Mode FETs by Dong-Ru Hsieh, Yi-De Chan, Po-Yi Kuo, Tien-Sheng Chao

Subjects: “…3-D integrated circuits (ICs)…”
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Investigation of Nitrous Oxide Nitridation Temperatures on P-Type Pi-Gate Poly-Si Junctionless Accumulation Mode TFTs by Dong-Ru Hsieh, Kun-Cheng Lin, Tien-Sheng Chao

Subjects: “…3-D integrated circuits (ICs)…”
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3D circuit model for 3D IC reliability study by Tan, Cher Ming, He, Feifei

“…3D integrated circuit technology is an emerging technology for the near future, and has received tremendous attention in the semiconductor community. …”
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A framework for analog circuit optimization by Mitros, Piotr, 1979-

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The Chip Cooling Model and Route Optimization with Digital Microfluidics

“…The thermal management is always critical for 3D integrated circuit design. Hot spots due to spatially non-uniform heat flux in integrated circuits can cause physical stress that further reduces reliability. …”
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Design and building of solder and TSV daisy chain electromigration tester by Ser, Edwin Wei Jun.

“…Through Silicon Via (TSV) is a hot topic in today’s 3D Integrated Circuit. In order for TSV to be used commercially, reliable evaluation of TSV is necessary, especially on its electromigration. …”
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Technology for 3D System Integration for Flexible Wireless Biomedical Applications by Wen-Cheng Kuo, Chih-Wei Huang

“…The proposed system entails the use of 3D integrated circuit packaging concepts to integrate the chip and coil. …”
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Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages by Konstantin O. Petrosyants, Nikita I. Ryabov

“…The problem of thermal modeling of modern three-dimensional (3D) integrated circuit (IC) systems in packages (SiPs) is discussed. …”
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Growth of CNTs on graphene for future 3D-IC by Hagi, Theodore

“…This project is a part of a research project to realise a combined Graphene and CNTs interconnect to replace copper based interconnect for 3D Integrated Circuit. Graphene and CNTs have shown potential to be a replacement of copper interconnect, which suffer increase of resistivity for dimension below ~39 nm. …”
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