Design of 3D integrated circuits and systems / by Sharma, Rohit (Rohit Y.), editor, Iniewski, Krzysztof, 1960- editor

3D Integrated Circuit Cooling with Microfluidics by Shaoxi Wang, Yue Yin, Chenxia Hu, Pouya Rezai

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Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits by Muhammad Imran, Hyunseung Han, Jooho Kim, Taehyun Kwon, Jaeyong Chung, Joon-Sung Yang

Subjects: “…3-D integrated circuit…”
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Electrical modeling of through-silicon-via for 3D integrated circuits by Santhosh Onkaraiah.

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Handbook of 3D integration : technology and applications of 3D integrated circuits / by Garrou, Philip E., editor, Bower, Christopher Andrew, editor, Ramm, Peter, editor

Design for high performance, low power, and reliable 3D integrated circuits / by 236206 Lim, Sung Kyu

SA-based Approach to Implement Digital Systems on 3D Integrated Circuits by Hemen Rahimi, Hadi Jahanirad

“…The 3D integrated circuit is emerged as a promising solution to integrate very large-scale circuits on electronics chips. …”
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Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits by Dipesh Kapoor, Cher Ming Tan, Vivek Sangwan

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Intermetallic compounds in 3D integrated circuits technology: a brief review by Syahira Annuar, Reza Mahmoodian, Mohd Hamdi, King-Ning Tu

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Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits by Nagarajan, Raghavan

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Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits by Leong, Hoi Liong, Gan, C.L., Pey, Kin Leong, Tsang, Chi-fo, Thompson, Carl V., Hongyu, Li

“…Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. …”
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Study on low temperature indium based solder for 3D integrated circuits application by Tee, Joel Han Yun.

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Investigation on bond strength and contact resistance of copper-copper bonds for 3D integrated circuits by Ong, Sharon Zi Xuan.

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On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits by Peyman Dehghanzadeh, Junjun Huan, Rohan Reddy Kalavakonda, Soumyajit Mandal, Swarup Bhunia

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A Novel 3D Integrated Circuit Technology Based on Stacked FinFET-CMOS Structure by Jin HE, Yuan REN, Jun PAN, Jingjing LIU

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Investigation of Monolithic 3D Integrated Circuit Inverter with Feedback Field Effect Transistors Using TCAD Simulation by Jong Hyeok Oh, Yun Seop Yu

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ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits

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ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits by Alam, Syed Mohiul, 1975-

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On the applicability of two‐bit carbon nanotube through‐silicon via for power distribution networks in 3‐D integrated circuits by Qing‐Hao Hu, Wen‐Sheng Zhao, Kai Fu, Da‐Wei Wang, Gaofeng Wang

“…Abstract This study investigates the possibility of the carbon nanotube (CNT)‐based through‐silicon vias (TSVs) for improving power integrity of 3‐D integrated circuits (3‐D ICs). The circuit model is developed for 2‐bit CNT TSV and validated through the full‐wave electromagnetic simulator HFSS simulations. …”
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Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology by Yifan Yao, Yuxuan An, K.N. Tu, Yingxia Liu

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