Embedded heat pipe SiC interposer for distributed power devices by Wei Li, Wenbing Qian, Xiaoliang Zhao, Zhenyu Wang, Wei Wang, Xiaobin Zhang, Yongzhi Zhao

“…The hotspots' arrangement was identified by comparing thermal performance with hotspots' placing at 22.5°, 45°, and 90° in the vertical coordinate system. The 45° arrangement was settled by analyzing the effects on refilling path between the evaporation and condensation areas. …”
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