Development of earth-abundant copper photosensitizers for artificial photosynthesis by Ng, Yik Yie

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Effect of dye modification on the sorption of copper by coconut husk by Low, K. S., Lee, C. K., Wong, S. L.

Sorption of copper by dye-treated oil-palm fibres by Low, K.S., Lee, C.K., Lee, K.P.

“…Both dye-treated and natural oil-palm fibres from a palm-oil mill were used to remove copper and related heavy metal cations from solutions. …”
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Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong

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Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

“…Copper bond shear strength of 15 MPa is achieved even at 50MPa at 25°C with copper coated with C18. …”
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Studies on copper-catalyzed aerobic reactions of N-H imines by Ang, Gim Yean

“…On investigating copper-catalyzed aerobic reactions of N-H imines, it was discovered that the iminyl copper species formed from reaction of Grignard reactions with carbonitriles, could undergo either C-H oxygenation or C-C bond cleavage depending on the starting material. …”
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Tantalum based amorphous thin films as copper diffusion barrier by Yan, Hua

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Asymmetric allylic alkynylation catalyzed by guanidine copper(I) complex by Cui, Xiyang

“…My Ph.D. thesis is divided into three chapters here to better narrate the exploration of asymmetric allylic alkynylation of racemic chiral substrates catalyzed by (guanidine)copper(I) complex. Chapter 1 introduces the unique properties of guanidine-type molecules, including its neutral form (guanidine), cationic form (guanidinium) and anionic form (guanidinate). …”
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Low temperature deformation of copper single crystals oriented for multiple slip by Saimoto, Shigeo.

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Current status and future prospects of copper oxide heterojunction solar cells by Wong, Terence Kin Shun, Zhuk, Siarhei, Masudy-Panah, Saeid, Dalapati, Goutam K.

“…However, defects at the copper oxide heterojunction and film quality are still major constraining factors for achieving high power conversion efficiency, η. …”
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Wetting transition of sessile and condensate droplets on copper-based superhydrophobic surfaces by Zhao, Yugang, Zhang, Hui, Wang, Wei, Yang, Chun

“…Here, we report distinct wetting stabilities of two copper-based superhydrophobic surfaces which are with nano-asperities (diameter ∼70 nm) of different packing density. …”
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Copper-catalyzed aerobic [3+2] : annulation of N-alkenyl amidines by Wang, Yi-Feng, Zhu, Xu, Chiba, Shunsuke

“…A method for the synthesis of bi- and tricyclic amidines has been developed through copper-catalyzed aerobic [3+2]-annulation reaction of N-alkenyl amidines. …”
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SHERLOCK HOLMES : PILU SEORANG BANGSAWAN, MISTERI MAHKOTA PERMATA BERIL & MISTERI DI COPPER BEECHES = THE ADVENTURES OF THE NOBLE BACHELOR, THE ADVENTURES OF THE BERYL CORONET & THE ADVENTURES OF THE COPPER BEECHES / by Doyle, Arthur Conan, Sir, 1859-1930, author 284049, Fatimah Rodhiah Mohd Yusof, translator 620234

“…Sherlock Holmes cuba membuktikan anaknya itu tidak bersalah. Misteri di Copper Beeches - Sherlock Holmes dan Dr. Watson didatangi oleh seorang wanita muda bernama Violet Hunter, yang merasakan dirinya seperti dipaksa untuk menyamar sebagai seorang yang lain setelah bekerja sebagai pengasuh di sebuah rumah di Copper Beeches. …”

Synthesis of copper indium diselenide poly-3-hexylthiophene heterojunction quantum dot by Koh, Wei Jie.

“…Solvothermal syntheses of copper indium diselenide/Poly-3-hexylthiophene (P3HT) heterojunction quantum dot were carried out. …”
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Uniform synthesis of Copper-Nickel substrate for CVD synthesised twisted bilayer graphene by Ho, Keith Zhong Wei

“…Suitable substrate for twisted bilayer graphene production via CVD were studied, and bicrystal Copper Nickel alloy (CuNi) substrate was hinted to be a suitable candidate. …”
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Synergy of compress strain and antioxidant of platinum-copper for enhanced the oxygen reduction performance by Zhang, Jun, Liang, Pingjuan, Xu, Xinlan, Wang, Rong, Liu, Shuyue, Wang, Chunyuan, Liu, Boyu, Luo, Laizheng, Jin, Meng, Liu, Huan, Yi, Huan, Lu, Shi-Yu

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Study on morphology of copper-through silicon vias based on electron backscatter diffraction by Zhuo, Guoping.

“…This could be likely due to the copper vias having undergone oxidation as there was a period of waiting time before EBSD analysis was carried out. …”
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Investigation of nano-copper for electronic packaging application : solder metallization and die attach by Luo, Kaiming

“…Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. …”
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Electroless copper deposition as a seed layer on TiSiN barrier by Chen, Z., Xu, S., Chan, L., See, K. H., Law, S. B., Ee, Elden Yong Chiang

“…Electroless deposition of copper as a seeding technology has received considerable attention in back-end-of-line device fabrication. …”
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Copper nanoparticles embedded in a polyimide film for non-volatile memory applications by Gupta, Raju Kumar, Kusuma, Damar Yoga, Lee, P. S., Srinivasan, M. P.

“…Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. …”
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