Sampling Moiré method for full-field deformation measurement: A brief review by Qinghua Wang, Shien Ri

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Effect of flip-chip ball grid array structure on capillary underfill flow by Hao-Hsi Hung, Yu-Chi Cheng, Sheng-Jye Hwang, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, Chen-Chao Wang, Chih-Pin Hung

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Flip-chip package solder-underfill reliability using finite element analysis by Niño Rigo Emil G. Lim, Aristotle T. Ubando, Jeremias A. Gonzaga

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A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning by Jiunn-Horng Lee, Chia-Hsiu Ou, Chih-Min Yao, Ming-Hsiao Lee

Subjects: “…Flip chip package…”
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Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices by He Guan, Dong Wang, Wentao Li, Duo Liu, Borui Deng, Xiang Qu

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Single Flip-Chip Packaged Dielectric Resonator Antenna for CMOS Terahertz Antenna Array Gain Enhancement by Chun-Hsing Li, Te-Yen Chiu

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