Microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced by hot-compression bonding by Shengqing Wu, Sheng Liu, Hexin Wang, Shaofei Ren, Bin Xu, Xiaopeng Zhang, Mingyue Sun

Subjects: “…Hot-compression bonding…”
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Investigation on the microstructure and mechanical properties of large-tube forging manufactured by additive forging by Bing Wang, Hong-Lin Zhang, Bin Xu, Ming-Yue Sun, Dian-Zhong Li

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Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding by Shaofei Ren, Xiaolong Bai, Sheng Liu, Mingyue Sun, Bin Xu, Chuanyong Cui, Guangcai Ma

Subjects: “…Hot-compression bonding…”
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Interfacial characteristics, interfacial oxide evolution and bonding mechanism of 2219 aluminum alloy joints manufactured by hot-compression bonding by Dazhao Xu, Mingxi Jiang, Linggang Meng, Mengqi Zhu, Yunfeng Liu, Xingguo Zhang

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Grain boundary migration behavior and microstructure evolution during multilayer additive hot-compression bonding by Jiajing Liu, Yubo Zhang, Junrui Huang, Yuting Shen, Shipeng Yue, Jiale Chen, Qidong Ma, Tingju Li

Subjects: “…Multilayer additive hot-compression bonding…”
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A hot-compression bonding method for manufacturing large high-speed homogeneous steels by Weifeng Liu, Jianyang Zhang, Mingyue Sun, Bin Xu, Yanfei Cao, Dianzhong Li

Subjects: “…Hot-compression bonding…”
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Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy by Jianqiang Wang, Weifeng Liu, Bin Xu, Bijun Xie, Sheng Liu, Honglin Zhang, Mingyue Sun, Dianzhong Li

Subjects: “…Hot compression bonding…”
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Interfacial microstructure evolution and bonding mechanism transformation of CoCrFeMnNi high-entropy alloy joints fabricated by vacuum hot-compression bonding by Chuanzong Li, Yi Zheng, Yajie Wang, Chun Yu, Jieshi Chen, Hao Lu, Kejin Zhang

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Promoting the interface connection of hot-compression bonded stainless steel via introducing a novel electroshocking treatment by Dongsheng Qian, Wentao Li, Jiadong Deng, Feng Wang, Min Wu

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