Showing 1 - 20 results of 56 for search '"Microelectronic package"', query time: 0.47s Refine Results
  1. 1
    Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method

    Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method by Yang, Zhenglin, Lee, Jung Hong, Liu, Guirong, Patera, Anthony T., Lam, Khin Yong

    Published 2003
    Subjects:
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    Article
  2. 2
    Microelectronics packaging handbook/

    Microelectronics packaging handbook/ by Tummala, Rao R., Rymaszewski, Eugene J.

    Published 1989
    Subjects: “…Microelectronic packaging…”
  3. 3
    Substrate warpage analysis during solder reflow process /

    Substrate warpage analysis during solder reflow process / by 384464 Beh, Keh Shin

    Published 2004
    Subjects: “…Microelectronic packaging…”
  4. 4
    Microelectronic packaging /

    Microelectronic packaging / by Datta, Madhav, Tetsuya, Osaka, 1945-, Schultze, J. W. (Joachim Walter)

    Published 2005
    Subjects: “…Microelectronic packaging…”
  5. 5
    Advanced electronic packaging /

    Advanced electronic packaging / by Brown, William D., 1943-, Ulrich, Richard K.

    Published 2006
    Subjects: “…Microelectronic packaging…”
  6. 6
    Introduction to microsystem packaging technology /

    Introduction to microsystem packaging technology / by 517165 Jin, Yufeng, Wang, Zhiping, 1962- Oct. 6-, Chen, Jing, 1974-

    Published c201
    Subjects: “…Microelectronic packaging.…”
  7. 7
    Semiconductor packaging : materials interaction and reliability /

    Semiconductor packaging : materials interaction and reliability / by Chen, Andrea 526875, Lo, Randy 526876

    Published c201
    Subjects: “…Microelectronic packaging…”
  8. 8
    Microwave and millimeter-wave electronic packaging /

    Microwave and millimeter-wave electronic packaging / by Sturdivant, Rick

    Published 2014
    Subjects: “…Microelectronic packaging…”
  9. 9
    STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING

    STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING by LIANG Ying, HUANG ChunYue, YIN Rui, HUANG Wei, LI TianMing, ZHAO HongWang

    Published 2016-01-01
    Subjects: “…Microelectronic package…”
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    Article
  10. 10
    Materials for advanced packaging /

    Materials for advanced packaging / by Lu, Daniel, Wong, C. P., 1947-

    Published 2009
    Subjects:
  11. 11
    Reliability of electronic packages and semiconductor devices /

    Reliability of electronic packages and semiconductor devices / by 323212 Di Giacomo, Giulio

    Published 1997
    Subjects:
  12. 12
    Electrostatic sensor design and sensor characteristic study for electrostatic charge measurement /

    Electrostatic sensor design and sensor characteristic study for electrostatic charge measurement / by Mohd. Riduwan Ghazali, 1984-, Mohd. Fua'ad Rahmat, Fakulti Kejuruteraan Elektrik

    Published 2010
    Subjects: “…Microelectronic packaging…”
  13. 13
    Electrostatic sensor design and sensor characteristic study for electrostatic charge measurement [electronic resource] /

    Electrostatic sensor design and sensor characteristic study for electrostatic charge measurement [electronic resource] / by Mohd. Riduwan Ghazali, 1984-

    Published 2010
    Subjects: “…Microelectronic packaging…”
  14. 14
    Polymers in microelectronics : fundamentals and applications/

    Polymers in microelectronics : fundamentals and applications/

    Published 1989
    Subjects:
  15. 15
    Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] /

    Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / by 217123 Ong, You Yang @ Bryan Ong

    Published 2001
    Subjects:
  16. 16
    High performance electronic packaging /

    High performance electronic packaging / by International Conference on High Performance Electronic Packaging (1990 : London, UK), Johnson, Keith (Keith I.), Institute of Physics (Great Britain), Welding Institute, Institution of Electrical Engineers (Great Britain)

    Published 1991
    Subjects:
  17. 17
    Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /

    Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish / by 458141 Mah, Chia Wen

    Published 2003
    Subjects: “…Microelectronic packaging…”
  18. 18
    Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements /

    Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / by Cohn, Charles, Harper, Charles A.

    Published 2005
    Subjects: “…Microelectronic packaging…”
  19. 19
    Mems packaging /

    Mems packaging / by Hsu, Tai-Ran

    Published 2004
    Subjects:
  20. 20
    Multichip modules : systems advantages, major constructions, and materials technologies

    Multichip modules : systems advantages, major constructions, and materials technologies by 391896 Johnson, R. Wayne, Balde, John W., Teng, Robert K. F.

    Published 1991
    Subjects:

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