Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties by Xinxin Li, Yimeng Wang, Yingchun Guan

“…In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), laser micro-Raman spectroscopy were utilized to characterize the surface quality of laser-grinded Si. …”
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