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    Physical properties of some unfilled resins employed in semiconductor packages by Enis Tuncer, Alex Hernandez-Luna

    Published 2018-01-01
    “…The reported resins are commonly used in Texas Instrument Incorporated products. The study was performed to better understand the influence of the resin system on physical properties of mold compounds, which are composed of mainly epoxy resin and inorganic filler particles. …”
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