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Physical properties of some unfilled resins employed in semiconductor packages
Published 2018-01-01“…The reported resins are commonly used in Texas Instrument Incorporated products. The study was performed to better understand the influence of the resin system on physical properties of mold compounds, which are composed of mainly epoxy resin and inorganic filler particles. …”
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Technologies for Ultradynamic Voltage Scaling
Published 2012Get full text
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Decoder Hardware Architecture for HEVC
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A 0.68V 0.68mW 2.4GHz PLL for ultra-low power RF systems
Published 2015Get full text
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Diffuse imaging: Replacing lenses and mirrors with omnitemporal cameras
Published 2012Get full text
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