Energy transfer and power consumption analysis of coaxial ring TSV by Junhao Wang, Bihao Sun, Zhiyuan Zhu

Subjects: Get full text

A non-linear analytic stress model for the analysis on the stress interaction between TSVs by Ming-Han Liao, Ssu-Chieh Kao, Sung-Jie Huang

Subjects: Get full text

Low Stress TSV Arrays for High-Density Interconnection by Binbin Jiao, Jingping Qiao, Shiqi Jia, Ruiwen Liu, Xueyong Wei, Shichang Yun, Yanmei Kong, Yuxin Ye, Xiangbin Du, Lihang Yu, Bo Cong

Subjects: Get full text

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology by Pooja Batra, Spyridon Skordas, Douglas LaTulipe, Kevin Winstel, Chandrasekharan Kothandaraman, Ben Himmel, Gary Maier, Bishan He, Deepal Wehella Gamage, John Golz, Wei Lin, Tuan Vo, Deepika Priyadarshini, Alex Hubbard, Kristian Cauffman, Brown Peethala, John Barth, Toshiaki Kirihata, Troy Graves-Abe, Norman Robson, Subramanian Iyer

Subjects: Get full text

Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects by Baohui Xu, Rongmei Chen, Jiuren Zhou, Jie Liang

Subjects: Get full text

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications by Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang

Subjects: Get full text

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) by Youjung Kim, Sanghyun Jin, Kimoon Park, Jinhyun Lee, Jae-Hong Lim, Bongyoung Yoo, Bongyoung Yoo, Bongyoung Yoo

Subjects: “…through-silicon-via (TSV)…”
Get full text

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias by K. Grigoras, N. Yurttagul, J.-P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H.-X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hatinen, D. Datta, V. Vesterinen, L. Gronberg, J. Biznarova, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius

Subjects: “…superconducting through-silicon via (TSV)…”
Get full text

A Design Method and Application of Meta-Surface-Based Arbitrary Passband Filter for Terahertz Communication by Da Hou, Lihui Wang, Qiuhua Lin, Xiaodong Xu, Yin Li, Zhiyong Luo, Hao Chen

Subjects: Get full text

Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults by Seokjun Jang, Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang

Subjects: Get full text

Modeling and Validation of Total Ionizing Dose Effect on the TSVs in RF Microsystem by Lihong Yang, Zhumeng Li, Guangbao Shan, Qijun Lu, Yu Fu

Subjects: Get full text

Enhanced plasma etching using nonlinear parameter evolution by Arjun Moothedath, Zhong Ren

Subjects: Get full text

Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology by Hai Dong, Yingtao Ding, Han Wang, Xingling Pan, Mingrui Zhou, Ziyue Zhang

Subjects: Get full text

Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits by Muhammad Imran, Hyunseung Han, Jooho Kim, Taehyun Kwon, Jaeyong Chung, Joon-Sung Yang

Subjects: Get full text

Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor by Haiwang Li, Jiasi Liu, Tiantong Xu, Jingchao Xia, Xiao Tan, Zhi Tao

Subjects: “…through-silicon-vias (TSV)…”
Get full text

A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices by Heulbi Ahn, Jaeseok Bae, Jungjae Park, Jonghan Jin

Subjects: “…Through-silicon Vias (TSV)…”
Get full text

Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss by Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder, Brajesh Kumar Kaushik

Subjects: Get full text