Advances in Transient-Liquid-Phase Bonding of Ultra-high Temperature ZrC Ceramics by Sciti Diletta, Silvestroni Laura, Esposito Laura, Nakashima Kunihiko, Saito Noritaka, Yamaoka Yoshinori, Glaeser Andreas M.

Subjects: “…transient-liquid-phase bonding…”
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Thermomechanical properties of Zeta (Ag₃In) phase by Liu, Xunda, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi

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Impulse Pressure-Assisted Diffusion Bonding (IPADB): Review and Outlook by Abdulaziz AlHazaa, Nils Haneklaus, Zeyad Almutairi

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Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints by Abdulaziz AlHazaa, Nils Haneklaus

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Enhancing the Mechanical Properties of Transient-Liquid-Phase Bonded Inconel 617 to Stainless Steel 310 through Altering Process Parameters and Homogenisation by Arash Dehghan, Rahmatollah Emadi, Yunes Asghari, Hosein Emadi, Saeid Lotfian

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A low-temperature joining technology suitable for high-temperature applications developed by establishing chemical potential and supercooling gradients by Jia Yang, Wanqi Zhao, Panpan Lin, Qiuguang Zhang, Xinfei Zhang, Weihang Liu, Tiesong Lin, He Peng, Yanli Zhuang

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High temperature resistant aging stability of lead-free solder joints by TLP bonding by LI Zheng-bing, WANG De, HU De-an, CHEN Yi-ping, CHENG Dong-hai, GUO Yi-le, HE Kai, HUANG Shuo, LI Xiao-jun

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Induction transient liquid phase bonding of Inconel 718 with the nickel-based sintered brazing preform by Yan, Guangxu, Nagarajan, Balasubramanian, Bhowmik, Ayan, Tan, Sung Chyn, Xu, Ray, Tan, Ming Jen

Subjects: “…Induction Transient Liquid Phase Bonding…”
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Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer by Chaiyoot Meengam, Yongyuth Dunyakul, Dech Maunkhaw, Suppachai Chainarong

Subjects: “…Transient Liquid Phase Bonding…”
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Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter by Zuohuan Chen, Daquan Yu, Yi Zhong

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Effect of bonding temperature and bonding time on microstructure of dissimilar transient liquid phase bonding of GTD111/BNi-2/IN718 system by Ali Izadi Ghahferokhi, Masoud Kasiri-Asgarani, Reza Ebrahimi-kahrizsangi, Mahdi Rafiei, Hamid Reza Bakhsheshi-Rad, Kamran Amini, Filippo Berto

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The Effect of Power Ultrasound on Microstructure Evolution During the Transient Liquid Stage of Ultrasonic-Promoted TLP Bonding SiCp/Al MMCs by Changzhuang Zhou, Lin Ma, Chao Zhu, Qinghe Cui, Jindi Liang, Yujian Song

Subjects: “…transient liquid phase bonding…”
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Interfacial Behavior and Shear Strength of Al-25Si-4Cu-1Mg Joints by Transient Liquid Phase Bonding with Cu as Interlayer by Kai Qi, Guo Xu, Fengjiang Wang

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Transient liquid phase (TLP) bonding of Ti–6Al–4V/AISI 304 stainless steel using Cu/CNT composite interlayer by Iman Aghaei Ghahderijani, Abbas Bahrami, Morteza Shamanian, Mohammad Amin Mokhtari

Subjects: “…Transient liquid phase bonding…”
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Microstructure and mechanical properties of TLP-bonded 9CrMoCoB heat-resistant steel with Ni–Cr–B interlayer by Yingjun Jiao, Guangmin Sheng, Xue Li, Yuntao Zhang, Xinjian Yuan

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Recent Progress in the Joining of Titanium Alloys to Ceramics by Sónia Simões

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Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications by Min-Haeng Heo, Young-Jin Seo, Jeong-Won Yoon

Subjects: “…Transient liquid phase bonding…”
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Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints by Gu X.Y., Duan Z.Z., Gu X.P., Sun D.Q.

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Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment by Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao

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Microstructure evolution and mechanical properties of a Fe, Cr-rich multiphase Ni3Al-based superalloy during transient liquid phase bonding process by Minghao Hu, Chong Li, Liming Yu, Huijun Li, Zumin Wang, Yongchang Liu

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