Compositional and morphological analysis of FeW films modified by sputtering and heating by Petter Ström, Daniel Primetzhofer, Thomas Schwarz-Selinger, Kazuyoshi Sugiyama

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The effects of tungsten concentration on crystalline structure and perpendicular magnetic anisotropy of Co-W films by S. Q. Yin, Y. Wu, X. G. Xu, H. Wang, J.P. Wang, Y. Jiang

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Direct Growth of Low Thermal Conductivity WTe₂ Nanocrystalline Films on W Films by Zhisong Yu, Rong Tao, Jin Guo, Shiyi Feng, Yue Wang

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Fluence Dependence of Surface Morphology and Deuterium Retention in W Bulks and Nanocrystalline W Films Exposed to Deuterium Plasma by Jing Yan, Xia Li, Kaigui Zhu

“…The blisters on the surface of W films are smaller in size and lower in density than those of the W bulks. …”
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A Comparative Investigation on the Microstructure and Thermal Resistance of W-Film Sensor Using dc Magnetron Sputtering and High-Power Pulsed Magnetron Sputtering by Jing Huan, Zhengtao Wu, Qimin Wang, Shihong Zhang, Se-Hun Kwon

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Progress in the preparation of high-quality wafer-scale monolayer and multilayer MS2 (M = Mo; W) films by CVD by Yangkun Zhang, Boxin Wang, Dongxia Shi, Guangyu Zhang

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High Transient-Thermal-Shock Resistant Nanochannel Tungsten Films by Tao Cheng, Wenjing Qin, Youyun Lian, Xiang Liu, Jun Tang, Guangxu Cai, Shijian Zhang, Xiaoyun Le, Changzhong Jiang, Feng Ren

Subjects: “…nanochannel W films…”
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Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO₂-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Pl... by Seong-In Kim, Gi-Ppeum Jeong, Seung-Jae Lee, Jong-Chan Lee, Jun-Myeong Lee, Jin-Hyung Park, Jae-Young Bae, Jea-Gun Park

“…For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive (i.e., ZrO₂) dispersant stability in the CMP slurry by adding a scavenger to suppress the Fenton reaction. …”
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Thermal Stability of Sputtered Tungsten Nitrides for Solar Thermal Applications by Anna Castaldo, Emilia Gambale, Laura Iemmo

“…In particular, the 300 W film of poor crystalline quality as deposited, after annealing released entrapped nitrogen and retained its W₂N structure up to a temperature of 580 °C. …”
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Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films by Haseeb, A.S. Md. Abdul, Chew, C.S., Johan, M.R.

“…The bright layer is found to be amorphous and is suggested to have formed through solid state amorphization caused by anomalously fast diffusion of Sn into Ni-W film.…”

Studies on cracking issues of pulsed electrodeposited Nickel-Tungsten thin films by Zhu, Jianfeng.

“…Nickel-tungsten (Ni-W) film has wide applications either as surface protective coatings for tooling, storage media, and plastic mold or as a thin film structure member in microelectronic and MEMS devices. …”
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O intermedialnych relacjach między filmem i grami wideo by Piotr Zawojski

“… Książka Joanny Pigulak Gra w film. Z zagadnień relacji między filmem i grami wideo (2022) to interdyscyplinarne studium dotyczące relacji zachodzących pomiędzy filmem i grami wideo. …”
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Historie równoległe, zbieżne, przeciwstawne. Teatr dramatyczny w filmie jako alternatywa i dopełnienie fabuły by Piotr Dobrowolski

“…Spektakl teatralny, włączany w film jako „wyrażenie cudzysłowowe”, uruchamia – zależnie od kompetencji odbiorcy – całość swoich znaczeń. …”
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Effects of glycerol and stearic acid on the performance of chickpea starch-based coatings applied to fresh-cut papaya by Shivania Kathiresan, Ola Lasekan

“…Glycerol was employed as plasticizer and stearic acid was incorporated in proportions of; 0 %, 1%, 2%, and 3% (w/w). Film with 30% glycerol, 1% stearic acid, 5 g of starch, and 5% aloe Vera was chosen because it had low film solubility and water vapour permeability (29.54 ± 0.21, 2.99 ± 0.21), respectively. …”
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The effect of doped glazing on thermal comfort: A case study of solar decathlon Africa by El Mehdi El Khattabi, Mohammed Zouini, Ouazzani Jamil Mohammed

“…The results of our study indicate that the VO2/W film coating has a great potential to increase the comfort conditions in buildings, both in winter and in summer. …”
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The Thermal Resistance Performance of WTi Alloy-Thin-Film Temperature Sensors Prepared by Magnetron Sputtering by Zhengtao Wu, Yintuan Zhang, Qimin Wang, Kwang-Ho Kim, Se-Hun Kwon

“….%, the temperature coefficient of resistance of the alloy film reached the maximum value of 19.5 × 10⁻⁴ K⁻¹, which is 3.6 times higher than that of the pure W film. After several thermal resistance tests, the temperature coefficient of resistance of the WTi alloy film with 6.8 at.% Ti decreased gradually. …”
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Effect of the Functionalization of Porous Silicon/WO3 Nanorods with Pd Nanoparticles and Their Enhanced NO2-Sensing Performance at Room Temperature by Xiaoyong Qiang, Ming Hu, Boshuo Zhao, Yue Qin, Ran Yang, Liwei Zhou, Yuxiang Qin

“…WO3 NRs were synthesized by thermally oxidizing W film on the PS substrate. Pd NPs were decorated on the surface of WO3 NRs via in-situ reduction of the Pd complex solution by using Pluronic P123 as the reducing agent. …”
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Nanostructured Magnéli-Phase W₁₈O₄₉ Thin Films for Photoelectrochemical Water Splitting by A. K. Mohamedkhair, Q. A. Drmosh, Mohammad Qamar, Z. H. Yamani

“…The film thickness of W₁₈O₄₉ is controlled by controlling the sputtering time (or deposition time) of W film. The PEC performance of the as-prepared electrodes is evaluated by monitoring the water oxidation reaction under visible radiation. …”
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Insight into the high-temperature tribological mechanism of VAlTiCrW high entropy alloy film: AlV3O9 from tribochemistry by Xuesong Liu, Jun Fan, Jibin Pu, Zhaoxia Lu

“…It is found that the VAlTiCrW film shows very low friction coefficient of 0.15 and a low wear rate of 10−5 orders of magnitude at 800 °C. …”
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Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation by Chew, C.S., Durairaj, R., Haseeb, A.S. Md. Abdul, Beake, B.

“…In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. W film after six times reflows were performed by nanoindentation. …”
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