Effect of Overmolding Injection Parameters on Warpage of PMMA-PC Composite Board by SUN Qi-wei, CHEN Yu-hong, YAN Yue, LANG Jian-lin, WANG Tao, GE Yong

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INTERPRETATION OF WARPAGE SIMULATION RESULTS IN ASMI by Ivan GAJDOŠ, Tomasz JACHOWICZ, Ján SLOTA, Volodymyr KRASYNSKYI

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MOLD DESIGN AND FLOW ANALYSIS FOR PRODUCT PROPELLER APC SF 11X4.7 WITH MINIMUM SHRINKAGE AND WARPAGE by Wahyu Puji Sahputra, Cahyo Budiyantoro, Gesang Nugroho, Muhammad Kevin Adam

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DEVELOPMENT OF ANODE SUPPORTED SOLID OXIDE FUEL CELL WITH IMPROVED WARPAGE BEHAVIOR by Safa Koç, Bora Timurkutluk, Selahattin Çelik

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Physical and Mechanical Bases of Alloyed Steel Deformation and Distortion of Large Case-Hardened Gear Wheels at the Production and Service by P.L. Mariev, V.I. Moiseenko, D.I. Kharitonchik, E.M. Tcutcurkin, N.D. Shkatulo

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THE INNFLUENCE OF THERMOPLASTIC MATERIAL GRIND PERCENTAGE by CHIRA Dan, Radu Gheorghe, MARIES Emil

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Increase in Warpage Prediction Accuracy for Glass Filled Polyamide Material (PA66) through Integrative Simulation Approach by Vivek Ramdas Gaval, M Divekar, A Wonisch, G Jadhav

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Fused deposition modeling of polypropylene-aluminium silicate dihydrate microcomposites by Chaka Kilole Tesfaye

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Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes by Brunella Cafra, Alessandra Alberti, Gaetano Calogero, Ioannis Deretzis, Antonio Landi, Daniele Pagano, Salvatore Sanzaro, Antonino La Magna

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Fused Deposition Modeling of Polyolefins: Challenges and Opportunities by Nandishwar Verma, Pratiksha Awasthi, Akash Gupta, Shib Shankar Banerjee

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Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization by Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia

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Wedge indentation characteristics of pressure-sensitive adhesives sandwiched by polyethylene terephthalate films by Satoshi KANEKO, Shigeru NAGASAWA

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Local thermal warpage deformation of polypropylene injection molded flat part and neural network prediction model by Jian Wang, Jian Wang, Tao Liu, Tao Liu, Kaihuang Zheng, Kaihuang Zheng, Hao Liu, Hao Liu, Hongdao Cui, Hongdao Cui, Hang Li, Hang Li

Subjects: “…warpage…”
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Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer by Dandan Liu, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu, Liangcheng Tu

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Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies by Pallavi Praful, Chris Bailey

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Multi-Grid Capacitive Transducers for Measuring the Surface Profile of Silicon Wafers by Panpan Zheng, Bingyang Cai, Tao Zhu, Li Yu, Wenjie Wu, Liangcheng Tu

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Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process by Wenchao Tian, Shuaiqi Zhang, Wenbin Li, Yuanming Chen, Jingrong Zhao, Fei Xin, Yingying Qian, Wenhua Li

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An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding by Seyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, Alberto Corigliano

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The simulation of the warpage rule of the thin-walled part of polypropylene composite based on the coupling effect of mold deformation and injection molding process by Zhang Jixiang, Yin Xiaoyi, Liu Fengzhi, Yang Pan

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Impact of Temperature and Substrate Type on the Optical and Structural Properties of AlN Epilayers: A Cross-Sectional Analysis Using Advanced Characterization Techniques by Wenwang Wei, Yi Peng, Yuefang Hu, Xiuning Xu, Quanwen Xie

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