High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging by Fan, Jiajie, Jiang, Dawei, Zhang, Hao, Hu, Dong, Liu, Xu, Fan, Xuejun, Zhang, Guoqi

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An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials by Liu Canyu, Liu Changqing

Subjects: “…high-temperature electronics packaging…”
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Recent Progress in Droplet-Based Manufacturing Research by Kim, H.-Y., Cherng, J.-P., Chun, Jung-Hoon

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Droplet Bouncing Behavior in the Direct Solder Bumping Process by Hsiao, Wayne, Chun, Jung-Hoon

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Journal of electronic packaging [jurnal elektronik]

Subjects: “…Electronic packaging…”
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Quality conformance and qualification of microelectronic packages and interconnects / by Pecht, Michael

Subjects: “…Electronic packaging…”

Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates by Franz Selbmann, Soumya Deep Paul, Maulik Satwara, Frank Roscher, Maik Wiemer, Harald Kuhn, Yvonne Joseph

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High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging by Jiajie Fan, Dawei Jiang, Hao Zhang, Dong Hu, Xu Liu, Xuejun Fan, Guoqi Zhang

Subjects: “…Power electronics packaging…”
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Rapid Flow Behavior Modeling of Thermal Interface Materials Using Deep Neural Networks by Simon Baeuerle, Marius Gebhardt, Jonas Barth, Ralf Mikut, Andreas Steimert

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Wire bonding in microelectronics / by 364840 Harman, George

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Wire bonding in microelectronics [electronic resource] / by 364840 Harman, George

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A 60 GHz Millimeter-Wave Antenna Array for 3D Antenna-in-Package Applications by Sandhiya Reddy Govindarajulu, Rimon Hokayem, Elias A. Alwan

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Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials by Zhenrui Zhou, Fengyong Lang, Vincentius Farlim, Zhongqing Zhang, Shiyang Li, Ruipeng Dong

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Electronics packaging materials and component-level degradation monitoring by Adwait Inamdar, Willem D. Van Driel, GuoQi Zhang

Subjects: “…electronics packaging…”
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Novel diamond grinding wheel for fine finishing of IC chip packaging for failure analysis / [nonprojected graphic]

Subjects: “…Electronic packaging…”

Principles of electronic packaging / by Seraphim, Donald P., Lasky, Ronald, Li, Che-Yu

Subjects: “…Electronic packaging…”

Study of interfacial reactions between lead-free solders and immersion silver finish / by Safoura Oshaghi, 1977-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Subjects: “…Electronic packaging…”
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Failure assessment of surface mount assembly under thermomechanical loading conditions / by 209274 Liew, Yek Ban, Mohd. Nasir Tamin, supervisor, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal

Subjects: “…Electronic packaging…”

Practical guide to the packaging of electronics : thermal and mechanical design and analysis / by Jamnia, Ali, 1961-

Subjects: “…Electronic packaging…”

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes / by Siti Rabiatull Aisha Idris, 1983-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Subjects: “…Electronic packaging…”