Nanotexturing of Silicon by Metal-Assisted Chemical Etching by Ye. I. Berezhanskyi, S. I. Nichkalo, V. Yu. Yerokhov, A. A. Druzhinin

“…<span>This paper describes the method of metal assisted chemical etching (MacEtch) as an efficient approach for structuring the silicon surface with the ability to manage effectively the geometric parameters of the structures and their distribution on the surface of substrate. …”
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DETERMINATION OF RESIDUAL STRESSES BY ETCHING CANTILEVERED SAMPLE by Yu V Belousov

“…The article describes experimental-theoretical method of determining technological sur- face residual stresses with application of layer-by-layer etching of the cantilever-fixed sample. The developed method of calculation of residual stresses in the surface layers of the material. …”
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Silicon flower structures by maskless plasma etching by Geng Zhao, Xiaoyan Zhao, Haimiao Zhang, Ziwei Lian, Yongmin Zhao, Anjie Ming, Yuanwei Lin

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Defect-Related Etch Pits on Crystals and Their Utilization by Dongzhu Lu, Quantong Jiang, Xiumin Ma, Qichao Zhang, Xiaole Fu, Liang Fan

Subjects: “…etch pit…”
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Modeling, Simulation and Calibration of Silicon Wet Etching by Andrzej Kociubiński, Mariusz Duk, Tomasz Bieniek, Paweł Janus

Subjects: “…anisotropic wet etching…”
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Anisotropic etching of 2D layered materials by Yuge Zhang, Qian Liu, Deliang Zhang, Yue Hong, Qiang Li

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The Effects Of Soft Drinks On Etched And Bonded Enamel by Banu Dinçer, Serpil Hazar, Hakan Şen

“…Teeth were first divided into 2 main groups: While the enamel of the teeth in first group was etched only, the specimens in the second group received bonding application following the etching procedure. …”
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Dancker Danckerts’s Etchings of Miseroni’s Crystal Pyramid by Saskia van Altena

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Microstructure Analysis of Thermally Etched Alumina Ceramics by Fudurić Jelača, M., Panjan, P., Rede, V., Ćurković, L., Lalić, M.

“…Porosity is determined on the polished sample; grain size is measured after thermal etching. The mean grain diameter is determined by means of lineal-intercept method, circular-intercept method and image analysis.…”
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Wet Chemical and Plasma Etching of Photosensitive Glass by Ulrike Brokmann, Christoph Weigel, Luisa-Marie Altendorf, Steffen Strehle, Edda Rädlein

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Wettability of polytetrafluoroethylene surfaces by plasma etching modifications. by Hyomin Kang, Sang Hyuk Lee, Kiwoong Kim

“…The PTFE surface was treated in two ways: plasma etching (PE) and reactive ion etching (RIE). The contact angle of the conventional PTFE surface was 113.8 ± 1.4°, but the contact angle of the manufactured surface was 152.3 ± 1.7° and 172.5 ± 1.2°. …”
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Edge lithography based on aluminum dry etching by Chenxu Zhu, Aixi Pan, Xiaoli Zhu, Shuo Zheng, Bo Cui

Subjects: “…Al etching…”
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Patterning two‐dimensional semiconductors with thermal etching by Miaomiao Liu, Ziwei Huang, Yukun Guo, Zhengwei Zhang, Liqiang Zhang, Hongmei Zhang, Jiang Zhong, Shanhao Li, Wei Deng, Di Wang, Wei Li, Ying Huangfu, Xiangdong Yang, Xidong Duan

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The Fringe-Capacitance of Etching Holes for CMOS-MEMS by Yi-Ta Wang, Yuh-Chung Hu, Wen-Chang Chu, Pei-Zen Chang

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Guided etching and deposition of transition metal dichalcogenides by Ke, Jian-An.

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Non-perfluorocompound chemistries for plasma etching of dielectrics by Tao, Benjamin A. (Benjamin Albert)

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Non-perfluorocompound chemistries for dielectric etching applications by Pruette, Laura C. (Laura Catherine), 1974-

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Multivariate endpoint detection of plasma etching processes by Goodlin, Brian E., 1974-

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Evaluation of unsaturated fluorocarbons for dielectric Etch applications by Chatterjee, Ritwik, 1974-

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Novel etch-stop materials for silicon micromachining by Wu, Kenneth Chu-Chao

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