Channel coding for high-speed links: A systematic look at code performance and system simulation by Blitvic, Natasa, Lee, Maxine, Stojanovic, Vladimir Marko

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A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications by Juncheng Bao, Gertjan Maenhout, Tomislav Markovic, Ilja Ocket, Bart Nauwelaers

Subjects: “…integrated circuit interconnections…”
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Comparative radio‐frequency and crosstalk analysis of carbon‐based nano‐interconnects by Manjit Kaur, Neena Gupta, Sanjeev Kumar, Balwinder Raj, Arun K. Singh

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A scalable CMOS Ising computer featuring sparse and reconfigurable spin interconnects for solving combinatorial optimization problems by Su, Yuqi, Mu, Junjie, Kim, Hyunjoon, Kim, Bongjin

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On the applicability of two‐bit carbon nanotube through‐silicon via for power distribution networks in 3‐D integrated circuits by Qing‐Hao Hu, Wen‐Sheng Zhao, Kai Fu, Da‐Wei Wang, Gaofeng Wang

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Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects by Miltiadis Moralis‐Pegios, Stelios Pitris, Charoula Mitsolidou, Konstantinos Fotiadis, Hannes Ramon, Joris Lambrecht, Johan Bauwelinck, Xin Yin, Yoojin Ban, Peter De Heyn, Joris Van Campenhout, Tobias Lamprecht, Andreas Lehnman, Nikos Pleros, Theoni Alexoudi

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Characterized Bioelectric Signals by Means of Neural Networks and Wavelets to Remotely Control a Human-Machine Interface by David Tinoco Varela, Fernando Gudiño Peñaloza, Carolina Jeanette Villaseñor Rodelas

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Embedding delay‐based physical unclonable functions in networks‐on‐chip by Prasad Nagabhushanamgari, Vikash Sehwag, Indrajit Chakrabarti, Santanu Chattopadhyay

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Wireless network-on-chip: a survey by Shuai Wang, Tao Jin

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Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects by Wen-Sheng Zhao, Rui Zhang, Da-Wei Wang

Subjects: “…integrated circuit interconnects…”
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Dynamic crosstalk analysis of mixed multi-walled carbon nanotube bundle interconnects by Pankaj Kumar Das, Manoj Kumar Majumder, Brajesh Kumar Kaushik

Subjects: “…integrated circuit interconnections…”
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Effects of varying the through silicon via liners thickness on their hoop stresses and deflections by Juma Mary Atieno, Xuliang Zhang, He Song Bai

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Terahertz band communication using plasma wave propagation in multilayer graphene heterostructures by Shaloo Rakheja

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Electromagnetic Wave Theory and Applications by Kong, Jin Au, Ali, Sami M., Atkins, Robert G., Chang, Ike, Gu, Qizheng, Habashy, Tarek M., Lee, Check-Fu, Li, Kevin, Poh, Soon Y., Tsuk, Michael J., Tulintseff, Ann N., Yang, Ying-Ching Eric, Arnold, David V., Chu, Nelson C., Lim, Harold H., Lin, Freeman C., Nghiem, Son V., Shin, Robert T., Swartz, Albert A., Yueh, Herng A., Borgeaud, Maurice, Kiang, Jean-Fu

Subjects: “…High-Speed Integrated Circuit Interconnects…”
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Electromagnetic Wave Theory and Applications by Kong, Jin Au, Ali, Sami M., Shin, Robert T., Yang, Ying-Ching Eric, Habashy, Tarek M., Poh, Soon Y., Atkins, Robert G., Chang, Ike, Gu, Qizheng, Lee, Check-Fu, Li, Kevin, Sheen, David M., Tsuk, Michael J., Tulintseff, Ann N., Xia, Jiging, Einziger, Pinchas D., Arnold, David V., Chu, Nelson C., Lim, Harold H., Nghiem, Son V., Yueh, Herng A., Borgeaud, Maurice, Han, Hsiu C., Tassoudji, Mohammad A., Kiang, Jean-Fu, Lam, Cheung-Wei, Veysoglu, Murat A., Afridi, Khurram K., Wang, Li-Fang

Subjects: “…High-Speed Integrated Circuit Interconnects…”
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Electromagnetic Wave Theory and Applications by Kong, Jin Au, Ali, Sami M., Shin, Robert T., Yang, Ying-Ching Eric, Habashy, Tarek M., Atkins, Robert G., Gu, Qizheng, Han, Hsiu C., Lam, Cheung-Wei, Lee, Check-Fu, Nghiem, Son V., Sheen, David M., Tsuk, Michael J., Tulintseff, Ann N., Xia, Jiqing, Yeuh, Herng A., Arnold, David V., Chu, Nelson C., Lim, Harold H., Tassoudji, M. Ali, Barrett, John W., Chung, Daniel J. H., Herrara, Ramon F., Hsu, Chih-Chien, Huang, Gregory T., Mustafa, K., Roman, Barbara A., Veysoglu, Murat E., Wang, Li-Fang, Wong, Diana, Lee, Hongsing

Subjects: “…High-Speed Integrated Circuit Interconnects…”
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