Point of care testing of sports biomarkers: potential applications, recent advances and future outlook by Sharma, Antareep, Tok, Alfred Iing Yoong, Alagappan, Palaniappan, Liedberg, Bo

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Laser powder bed fusion of bimetallic stainless steel/nickel-based superalloy: interface and mechanical properties by Fan, Haiyang, Shi, Qimin, Wang, Chengcheng, Tian, Yujia, Zhou, Kun, Yang, Shoufeng

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Red-to-black electrochromism of 4,9-dihydro-s-indaceno[1,2-b:5,6-b’]dithiophene-embedded conjugated polymers by Cho, Ching Mui, Ye, Qun, Neo, Wei Teng, Lin, Tingting, Song, Jing, Lu, Xuehong, Xu, Jianwei

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Study of torque matching of revolving vane compressor and expander by Subiantoro, A, Ooi, Kim Tiow

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Palliatives for low velocity impact damage in composite laminates by Ali, Mubarak, Joshi, S. C., Mohamed Thariq Hameed Sultan

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Development and evaluation of aerogel-filled BMI sandwich panels for thermal barrier applications by Yong, Zhao, Joshi, Sunil Chandrakant, Sheikh, Abdullah Azhar, Dineshkumar, Arthanareswaran

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Decarburization during laser surface processing of steel by Maharjan, Niroj, Zhou, Wei, Zhou, Yu, Wu, Naien

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Synthesis, Characterization and Molecular Docking of New Naphthalene-Based Chalcone and Pyrazoline Compounds by Othmani, Taki Eddine, Alidmat, Mohammad Murwih, Khairuddean, Melati, Wahyuningsih, Tutik Dwi

Chemomechanics of ionically conductive ceramics for electrical energy conversion and storage by Swallow, Jessica Gabrielle, Lu, Qiyang, Kim, Jae Jin, Chiang, Yet-Ming, Yildiz, Bilge, Tuller, Harry L., Van Vliet, Krystyn J, Woodford, William H., Chen, Yan, Chen, Di, Carter, W Craig, Van Vliet, Krystyn J

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Improvement of densification and microstructure of ASTM A131 EH36 steel samples additively manufactured via selective laser melting with varying laser scanning speed and hatch spac... by Wang, Jingjing, Wu, Wen Jin, Jing, Wei, Tan, Xipeng, Bi, Gui Jun, Tor, Shu Beng, Leong, Kah Fai, Chua, Chee Kai, Liu, Erjia

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Nanoindentation hardness and modulus of Al2O3–SiO2–CaO and MnO–SiO2–FeO inclusions in iron by Slagter, Alejandra, Setyadji, Jonathan Aristya, Vogt, Eva Luisa, Hernández-Escobar, David, Deillon, Lea, Mortensen, Andreas

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Lowering thermal conductivity in thermoelectric Ti2−xNiCoSnSb half Heusler high entropy alloys by Mishra, Soumya Ranjan, Karati, Anirudha, Ghosh, Sanyukta, Mallik, Ramesh Chandra, Shabadi, Rajashekhara, Krishnan, P. S. Sankara Rama, Yadav, Satyesh Kumar, Ramanujan, Raju Vijayaraghavan, Murty, Budaraju Srinivasa

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Nano-coupling effects in nano-structured magnets by Nguyen, Vu Nguyen.

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Fine pitch electroless nickel plating by Zee, Bernice Mei Lin

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Hemocompatilibilization of biopolymer systems by Subbu S Venkatraman.

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Tantalum-based diffusion barriers for copper metallization by Khin Maung Latt.

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Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication by Kim, Jae Hyung.

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Chemical mechanical polishing process of copper metallization in the ULSI devices by Leow, Nelson Whatt Wei.

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Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices by Lim, Boon Kiat.

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Effect of electron beam radiation on the degradation of biopolymers by Loo, Joachim Say Chye

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