Interdisciplinarity as the Key to Efficient Education for Sustainable Development : Main Benefits and Challenges : a Nanotechnology Case Study by Agnieszka Dąbrowska

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DID Code: A Bridge Connecting the Materials Genome Engineering Database with Inheritable Integrated Intelligent Manufacturing by William Yi Wang, Peixuan Li, Deye Lin, Bin Tang, Jun Wang, Quanmei Guan, Qian Ye, Haixing Dai, Jun Gao, Xiaoli Fan, Hongchao Kou, Haifeng Song, Feng Zhou, Jijun Ma, Zi-Kui Liu, Jinshan Li, Weimin Liu

Subjects: “…Integrated computational materials engineering…”
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Chemical vapour deposition growth of large-area graphene on metals by Murdock, AT

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Micro-deformation and texture in engineering materials by Kiwanuka, R

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Current Trends in Materials Engineering II, : 25th Scientific Conference of the Microscopy Society : Selected, peer reviewed papers from the 25th Scientific Conference of the Microscopy Society Malaysia (25th SCMSM 2016) December 7-9, 2016, Bangi, Selangor, Malaysia / by Scientific Conference of the Microscopy Society Malaysia 2016 : Bangi, Selangor, Malaysia, Muhamad Azizi Mat Yajid, author, Mariatti Jaafar, editorUNAUTHORIZED, Zainovia Lockman, editor, Najwa Hamzan, author, Muhammad Firdaus Omar, author, Huay, Nay Ming, author, Boon, Tong Goh, author, Ayad Omran Abdalla, author, Astuty Amrin, author, Roslina Mohammad, author, M.A. Azmah Hanim, author, Zulhelmi Alif Abdul Halim, author, Mohd. Hasbullah Idris, author, Halimaton Hamdan, author, M. N. Suraya, author, B. Hariffin, author, Nur Azmah Nordin, 1989-, author, Tuty Asma Abu Bakar, author, Esah Hamzah, author, Saeed Farahany, author, Ali Ourdjini, author, N. Mohamad Jafar, author, T. Amano, author, C. Y. Chong, author, N. H. Ahmad, author

Editorial: Covid-19: Materials Science and Engineering Challenges by Nicola Maria Pugno, Nicola Maria Pugno, John L. Provis, Liming Dai, Alessandro Pegoretti, Valeria Cannillo, Weihua Li

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Effect of Printing Orientation on the Mechanical Properties of Low-Force Stereolithography-Manufactured Durable Resin by Antonio Martínez Raya, Josué Aranda-Ruiz, Gastón Sal-Anglada, Sebastián Martín Jaureguizahar, Matías Braun

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Editorial: Women in science: materials 2023 by Giulia Masi, Tadeja Kosec, Ilaria Cacciotti, Patricia Krawczak

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Unravelling the Potential of Density Functional Theory through Integrated Computational Environments: Recent Applications of the Vienna Ab Initio Simulation Package in the MedeA<su... by Volker Eyert, Mikael Christensen, Walter Wolf, David Reith, Alexander Mavromaras, Clive Freeman, Erich Wimmer

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Special Issue “Fundamentals and Recent Advances in Epitaxial Graphene on SiC” by Ivan Shtepliuk, Rositsa Yakimova

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Bioperformance Studies of Biphasic Calcium Phosphate Scaffolds Extracted from Fish Bones Impregnated with Free Curcumin and Complexed with β-Cyclodextrin in Bone Regeneration by Cecilia V. R. Truite, Jessica N. G. Noronha, Gabriela C. Prado, Leonardo N. Santos, Raquel S. Palácios, Adriane do Nascimento, Eduardo A. Volnistem, Thamara T. da Silva Crozatti, Carolina P. Francisco, Francielle Sato, Wilson R. Weinand, Luzmarina Hernandes, Graciette Matioli

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Editorial: Women in science: Materials 2021 by Patricia Krawczak, Lucia Baldino, Francisca Garcia Caballero, Ya Wang

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Enzymatic Biofuel Cells: A Review on Flow Designs by Linda Barelli, Gianni Bidini, Dario Pelosi, Elena Sisani

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Spider Silk and the Silk of Egg Sacs with its Astonishing Concealed Attributes: A Review by Tanmaya R. Sethy, Janak Ahi

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Editorial: Women in Science: Materials by Maria Chiara Bignozzi, Jacqueline Anne Johnson, Patricia Krawczak, Emilia Morallon, Ming Xu

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Critical Aspects of Energetic Transition Technologies and the Roles of Materials Chemistry and Engineering by Guido Busca

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Characterization of direct ink write pure silk fibroin based on alcohol post-treatments by Enric Casanova-Batlle, Antonio J. Guerra, Joaquim Ciurana

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The mechanics of cam-type femoroacetabular impingement by Ng, AYC

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Modelling residual stresses and deformation in metal at different scales by Song, X

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Large area vacuum fabrication of organic thin-film transistors by Ding, Z

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