-
201
Stress calculation and failure prevention for microelectronics devices
Published 2012“…This project presents a numerical investigation on the thermo-mechanical reliability of microelectronics devices. Thermo-mechanical reliability is one of the major bottlenecks for both current and future microelectronics devices. …”
Get full text
Final Year Project (FYP) -
202
Structure and properties of polymers for microelectronic and photonic application
Published 2008“…The objective of this study is to understand the interactions between P3AT and PVK, and to investigate the effects of blending on photonic and microelectronic performance of these materials.…”
Get full text
Thesis -
203
Characterizing the interfacial fracture toughness for microelectronic packaging
Published 2012“…In a microelectronic package there are many interfaces where the adhesion between different materials plays an important role in its reliability issue. …”
Get full text
Get full text
Journal Article -
204
USM, SILTERRA SIGNS AGREEMENT IN MICROELECTRONICS INDUSTRY
Published 2016“…Bhd. for the access to the Multi Project Wafer (MPW) in completing the microelectronics ecosystem at the university which comprised of designing, confirmation, fabrication, testing and measuring as well as packaging.…”
Get full text
Article -
205
USM-INSTITUT TEKNOLOGI BANDUNG TO COLLABORATE IN MICROELECTRONICS
Published 2015“…PENANG, June 2015 Universiti Sains Malaysia (USM) has recently extended its strategic cooperation with Institut Teknologi Bandung (ITB), one of the leading institutions in Indonesia, to jointly develop capacity of both institutions especially in the field of Microelectronic Engineering.…”
Get full text
Article -
206
The master production schedule in MRP for microelectronic manufacturer
Published 2020“…To fulfill this task, our group chose CPU is one of the products in this microelectronics manufacturer. Organizing and plan the manufacture process generally occurs in production planning and control.…”
Get full text
Book Section -
207
Numerical Simulation Of A Microchannel For Microelectronic Cooling
Published 2007“…The paper discusses the numerical simulation of a micro-channel heat sink in microelectronics cooling. A three-dimensional Computational Fluid Dynamics (CFD) model was built using the commercial package, FLUENT, to investigate the conjugate fluid flow and heat transfer phenomena in a silicon-based rectangular microchannel heatsink. …”
Get full text
Get full text
Article -
208
-
209
-
210
-
211
New technology and the workers' response : microelectronics, labour and society /
Published 1995Subjects: -
212
-
213
Microelectronic engineering : an international journal of semiconductor manufacturing technology
Published 1983Subjects: “…Microelectronics…”
Get full text
-
214
Microelectronics failure analysis [compact disc] : desk reference /
Published 2004Subjects: “…Microelectronics…”
-
215
Future trends in microelectronics : from nanophotonics to sensors and energy /
Published c201Subjects: “…Microelectronics…”
-
216
Cooling of microelectronic and nanoelectronic equipment : advances and emerging research /
Published 2015Subjects: -
217
-
218
-
219
PRECISION MOTION SYSTEM FOR OPTO-MECHANICAL EQUIPMENT OF MICROELECTRONICS
Published 2015-08-01Get full text
Article -
220
Modeling of the wave electromagnetic processes in the microwave microelectronic material
Published 2017-12-01Get full text
Article