Showing 301 - 320 results of 1,728 for search '"semiconductor materials"', query time: 0.14s Refine Results
  1. 301
    Fabrication and characterisation of magnetoresistive thin films for field sensing application

    Fabrication and characterisation of magnetoresistive thin films for field sensing application by Shi, Xu.

    Published 2011
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Research Report
  2. 302
    Carbon based conductive thin film : fabrication, properties and application

    Carbon based conductive thin film : fabrication, properties and application by Tantang, Hosea

    Published 2012
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Thesis
  3. 303
    Development of high dielectric constant SrTiO3 thin films

    Development of high dielectric constant SrTiO3 thin films by Loo, Martin Chih Chien.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Thesis
  4. 304
    Cu metallization and dielectric removal for failure analysis of ICs

    Cu metallization and dielectric removal for failure analysis of ICs by Siah, Yu Wen.

    Published 2012
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  5. 305
    Electrical characterization of copper-based nanowire

    Electrical characterization of copper-based nanowire by Pah, Hazel Pei Lin

    Published 2012
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Final Year Project (FYP)
  6. 306
    Deposition, characterization, and device fabrication of GaN and AlN based thin film materials

    Deposition, characterization, and device fabrication of GaN and AlN based thin film materials by Ashraf Uddin.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Research Report
  7. 307
    Development and integration of new ultra low k materials & processes for high reliability microelectronics

    Development and integration of new ultra low k materials & processes for high reliability microelectronics by Mhaisalkar, Subodh Gautam.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Research Report
  8. 308
    Back-end-of-line process reliability of advanced semiconductor technology

    Back-end-of-line process reliability of advanced semiconductor technology by Park, Hun Sub.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Research Report
  9. 309
    Atomistic simulation of structure and mobility of dislocation in semiconductor

    Atomistic simulation of structure and mobility of dislocation in semiconductor by Choo, Zhi Min.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Thesis
  10. 310
    Poly(ethylene naphthalate) (PEN) / clay nanocomposites : preparation, structures and properties.

    Poly(ethylene naphthalate) (PEN) / clay nanocomposites : preparation, structures and properties. by Chua, Yang Choo

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  11. 311
    Study of the interfaces between electroless nickel under bump metallization and lead-free solders

    Study of the interfaces between electroless nickel under bump metallization and lead-free solders by He, Min.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  12. 312
    Tantalum-based diffusion barriers for copper metallization

    Tantalum-based diffusion barriers for copper metallization by Khin Maung Latt.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  13. 313
    Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication

    Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication by Kim, Jae Hyung.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  14. 314
    Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

    Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength by Kithva Prakash Hariram.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  15. 315
    Characterisation and applications of chemically amplified photoresists for DUV microlithography

    Characterisation and applications of chemically amplified photoresists for DUV microlithography by Koh, Hui Peng.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  16. 316
    Electroplating of copper metallization of sub-micron integrated circuits

    Electroplating of copper metallization of sub-micron integrated circuits by Law, Shao Beng.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  17. 317
    Chemical mechanical polishing process of copper metallization in the ULSI devices

    Chemical mechanical polishing process of copper metallization in the ULSI devices by Leow, Nelson Whatt Wei.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  18. 318
    Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

    Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment by Chen, Binling

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  19. 319
    Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices

    Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices by Lim, Boon Kiat.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis
  20. 320
    Study on copper electromigration reliability of the ULSI devices

    Study on copper electromigration reliability of the ULSI devices by Low, Joon Kiat.

    Published 2008
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects…”
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    Thesis

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