Showing 1 - 7 results of 7 for search '"solder bumping"', query time: 0.24s Refine Results
  1. 1
    Droplet Bouncing Behavior in the Direct Solder Bumping Process

    Droplet Bouncing Behavior in the Direct Solder Bumping Process by Hsiao, Wayne, Chun, Jung-Hoon

    Published 2003
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  2. 2
    FCCSP IMC growth under reliability stress follows automotive criteria

    FCCSP IMC growth under reliability stress follows automotive criteria by Wei Wei Liu, Berdy Weng, Scott Chen

    Published 2019-03-01
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  3. 3
    Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints

    Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints by Yuanxiang Zhang, Jicheng Zhang, Yong Wang, Yike Fang

    Published 2022-06-01
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  4. 4
    A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

    A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process by Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung

    Published 2021-10-01
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  5. 5
    A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials

    A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials by Ab Aziz bin Mohd Yusof, Mohd Al Fatihhi Mohd Szali Januddi, Muhamad Noor Harun

    Published 2022-11-01
    Subjects: “…Solder bump…”
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  6. 6
    Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

    Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP by Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan, Zhao Zhang

    Published 2023-06-01
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  7. 7
    32 × 32 Pixelated High-Power Flip-Chip Blue Micro-LED-on-HFET Arrays for Submarine Optical Communication

    32 × 32 Pixelated High-Power Flip-Chip Blue Micro-LED-on-HFET Arrays for Submarine Optical Communication by Tae Kyoung Kim, Abu Bashar Mohammad Hamidul Islam, Yu-Jung Cha, Joon Seop Kwak

    Published 2021-11-01
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