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    Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique

    Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique by Man Li, Yufeng Guo, Jiafei Yao, Jun Zhang, Fanyu Liu, Weihua Tang

    Published 2022-02-01
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