Tantalum based amorphous thin films as copper diffusion barrier by Yan, Hua

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Additive manufacturing of tantalum scaffolds: processing, microstructure and process-induced defects by Aliyu, AAA, Poungsiri, K, Shinjo, J, Panwisawas, C, Reed, RC, Puncreobutr, C, Tumkanon, K, Kuimalee, S, Lohwongwatana, B

“…Extreme melting point, high density, and ease of oxidation of tantalum (Ta) make its processing rather difficult using conventional methods. …”

Platinum/Tantalum Carbide Core–Shell Nanoparticles with Sub‐Monolayer Shells for Methanol and Oxygen Electrocatalysis by Wang, Zhenshu, Kang, Jin Soo, Göhl, Daniel, Paciok, Paul, Gonçalves, Danelle S., Lim, Hyung‐Kyu, Zanchet, Daniela, Heggen, Marc, Shao‐Horn, Yang, Ledendecker, Marc, Román‐Leshkov, Yuriy

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Point-Defect Segregation and Space-Charge Potentials at the Σ5(310)[001] Grain Boundary in Ceria by Usler, Adrian L., Heelweg, Henrik J., De Souza, Roger A., Genreith-Schriever, Annalena R.

“…Segregation energies were calculated for oxygen vacancies, electron polarons, gadolinium and scandium acceptor cations, and tantalum donor cations. These energies deviate strongly from their bulk values over the same length scale, thus indicating a structural grain-boundary width of approximately 1.5 nm. …”
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Measurement and error analysis of Cu film thickness with Ta barrier layer on wafer for CMP application by Qu, Zilian, Wang, Wensong, Li, Xueli, Li, Qi, Zheng, Yuanjin

“…However, existing thickness measurements of Cu film ignore the effect of tantalum (Ta) barrier layer between Cu film and Si substrate, which makes the measurement result inaccurate. …”
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Formation and characterization of magnetron sputtered Ta–Si–N–O thin films by Xu, S., Chen, Z., Yan, H., Li, L., Ho, F. Y., Liang, M. H., Pan, J. S.

“…Tantalum silicon nitride films have good potential to be used as hard coatings and diffusion barriers. …”
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