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    MEMS High Aspect Ratio Trench Three-Dimensional Measurement Using Through-Focus Scanning Optical Microscopy and Deep Learning Method

    MEMS High Aspect Ratio Trench Three-Dimensional Measurement Using Through-Focus Scanning Optical Microscopy and Deep Learning Method by Guannan Li, Junkai Shi, Chao Gao, Xingjian Jiang, Shuchun Huo, Chengjun Cui, Xiaomei Chen, Weihu Zhou

    Published 2022-08-01
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