Energy transfer and power consumption analysis of coaxial ring TSV by Junhao Wang, Bihao Sun, Zhiyuan Zhu

Subjects: Get full text

Spectroscopic Reflectometry for Optimizing 3D Through-Silicon-Vias Process by Yi-Sha Ku, Chun-Wei Lo, Cheng-Kang Lee, Chia-Hung Cho, Wen-Qii Cheah, Po-Wen Chou

Subjects: “…through-silicon via…”
Get full text

Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale by Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

Subjects: Get full text

A non-linear analytic stress model for the analysis on the stress interaction between TSVs by Ming-Han Liao, Ssu-Chieh Kao, Sung-Jie Huang

Subjects: Get full text

Low Stress TSV Arrays for High-Density Interconnection by Binbin Jiao, Jingping Qiao, Shiqi Jia, Ruiwen Liu, Xueyong Wei, Shichang Yun, Yanmei Kong, Yuxin Ye, Xiangbin Du, Lihang Yu, Bo Cong

Subjects: Get full text

High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs) by LEE, H., PARK, J. K., KIM, J. T.

Subjects: Get full text

An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias by Guangbao Shan, Guoliang Li, Dongdong Chen, Zifeng Yang, Di Li, Yintang Yang

Subjects: Get full text

The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors by Seung-Ho Ok, Yong-Hwan Lee, Jae Hoon Shim, Sung Kyu Lim, Byungin Moon

Subjects: “…through-silicon via…”
Get full text

Ultra-high-aspect-ratio structures through silicon using infrared laser pulses focused with axicon-lens doublets by Niladri Ganguly, Pol Sopeña, David Grojo

Subjects: Get full text

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology by Pooja Batra, Spyridon Skordas, Douglas LaTulipe, Kevin Winstel, Chandrasekharan Kothandaraman, Ben Himmel, Gary Maier, Bishan He, Deepal Wehella Gamage, John Golz, Wei Lin, Tuan Vo, Deepika Priyadarshini, Alex Hubbard, Kristian Cauffman, Brown Peethala, John Barth, Toshiaki Kirihata, Troy Graves-Abe, Norman Robson, Subramanian Iyer

Subjects: Get full text

Optimization of Additive and Current Conditions for Void-Free Filled Through-Silicon Via by Se-Hee Shin, Tea-Yoo Kim, Jong-Hwan Park, Su-Jeong Suh

Subjects: “…through silicon via…”
Get full text

Partial Coaxial Through-Silicon via for Suppressing the Substrate Noise in 3-Dimensional Integrated Circuit by Jinrong Su, Wenmei Zhang, Chunhui Yao

Subjects: Get full text

Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects by Baohui Xu, Rongmei Chen, Jiuren Zhou, Jie Liang

Subjects: Get full text

Integrated through-silicon-via-based inductor design in buck converter for improved efficiency by A. Namoune, R. Taleb, N. Mansour, M. R. Benzidane, A. Boukortt

Subjects: “…through-silicon-via-based inductor…”
Get full text

The design and optimization of novel elliptic cylindrical through‐silicon via and its temperature characterization by Wenbo Guan, Hongliang Lu, Yuming Zhang, Yimen Zhang

Subjects: Get full text

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications by Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang

Subjects: Get full text

A TSV Test Method for Resistive Open Fault and Leakage Fault Coexisting by Chang Hao, Xu Yong

Subjects: “…Through silicon via…”
Get full text

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) by Youjung Kim, Sanghyun Jin, Kimoon Park, Jinhyun Lee, Jae-Hong Lim, Bongyoung Yoo, Bongyoung Yoo, Bongyoung Yoo

Subjects: “…through-silicon-via (TSV)…”
Get full text

Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array by Xianglong Wang, Jiaming Su, Dongdong Chen, Di Li, Gaoliang Li, Yintang Yang

Subjects: “…coaxial through silicon via…”
Get full text

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias by K. Grigoras, N. Yurttagul, J.-P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H.-X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hatinen, D. Datta, V. Vesterinen, L. Gronberg, J. Biznarova, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius

Subjects: “…superconducting through-silicon via (TSV)…”
Get full text