Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish [electronic resource] / by Azizah Wahi, 1984-, Ali Ourdjini

Role of tin content in the wetting of Cu and Au by tin-bismuth solders / by 378472 Powers, Tamar A., Singler, T. J., Clum, J. A.

Subjects: “…Tin…”

TIN PHOSPHORUS NUCLEAR-SPIN COUPLING IN OCTAHEDRAL COMPLEXES OF TIN(IV) by Mcfarlane, W, Rees, N

“…Heteronuclear magnetic multiple resonance experiments are used to show that the large values of 1J(119Sn31P) found in tertiary phosphine complexes of tin tetrahalides are negative [corresponding to a positive 1K(SnP)], suggesting that the mean excitation energy approximation can provide a valid description of the Fermi contact contribution to this spin coupling interaction, in contrast to the situation for other types of SnP interaction over one bond. © 1989.…”

Evaluation Of Tin In Amang From Rahman Hydraulic Tin Sdn. Bhd. by Ameer, Nur Dinie

“…Since the RHT Amang is fine for further process to extract tin in amang, might best to use floatation method.…”
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Tin (IV) compounds / by 203569 Frances, Jean-Marc

Subjects: “…Tin compounds…”

Tin in organic synthesis / by 222764 Pereyre, Michael, Quintard, Jean-Paul, Rahm, Alain

The organic chemistry of tin/ by 223025 Neumann, Wilhelm P.

Subjects: “…Tin…”

Dicyclopentadienyl-tin and -lead / by 315242 Fritz, Heinz P., Fischer, E. O.

Geology of tin deposits by 375668 Taylor, Roger G.

Subjects: “…Tin ores…”

Tin and its alloys by 247854 Hedges, Ernest Sydney, Cuthbertson, J. W.

Subjects: “…Tin…”

Tin and its uses

Subjects: “…Tin industry…”

Malaysian tin bulletin by Tin Industry (Research and Development) Board

Subjects: “…Tin industry…”

The tin can tree / by Tyler, Anne, 1941-

Whisker growth in tin surface finishes by immersion tin plating and hot dipping / by Lim, Hooi Peng, 1983-, author, Tuty Asma Abu Bakar, supervisor, Fakulti Kejuruteraan Mekanikal

Tin/Tin Oxide Nanostructures: Formation, Application, and Atomic and Electronic Structure Peculiarities by Poting Liu, Vladimir Sivakov

Subjects: “…tin…”
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Tin and tin-titanium as catalyst components for reversible hydrogen storage of sodium aluminium hydride by Fu, Q, Tsang, S

Tin and tin-titanium as catalyst components for reversible hydrogen storage of sodium aluminium hydride by Fu, Q, Tsang, S

“…This paper is concerned with the effects of adding tin and/or titanium dopant to sodium aluminium hydride for both dehydrogenation and re-hydrogenation reactions during their reversible storage of molecular hydrogen. …”

Impact of tin fluoride additive on the properties of mixed tin-lead iodide perovskite semiconductors by Savill, KJ, Ulatowski, AM, Farrar, MD, Johnston, MB, Snaith, HJ, Herz, LM

“…A significant barrier to higher performance and stability is the ready oxidation of tin, commonly mitigated by various additives whose impact is still poorly understood for mixed tin‐lead perovskites. …”

Removal of Arsenic and Chromium Oxyanions by Hydrous Tin Dioxide and Tin(IV)-Loaded Exchangers by Tan, Wee Chang

“…The potential of tin-loaded poly(hydroxamic acid) ion exchange resin (SnPHA), hydrous tin dioxide (SnO2.xH2O) and hydrous tin dioxide-loaded poly(hydroxamic acid) resin (SnOPHA) to remove heavy metals As(V), As(III) and Cr(VI) from aqueous solution was investigated. …”
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The effects of nickel underlayer and solder dipping as tin whisker mitigations in tin surface finishes by Lim, Hooi Peng, Ourdjini, Ali, Abu Bakar, Tuty Asma

“…However, the adoption of lead-free tin (Sn) surface finish is known to form whiskers. …”