Geotechnical and micro-structural behaviour of chemically stabilized tropical residual soil by Latifi, Nima

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Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

“…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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Surface modification and characterization of polypropylene fibers by Tan, Terry Jian Hong.

“…Polypropylene fibers will undergo argon plasma treatment that uses RF plasma technology to explore the potential of surface modification as a means of improving the interfacial bonding strength. This surface modification comes with physical etching of the surface as well as alterations to the chemical characteristics of the fiber surface. …”
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A concise, efficient synthesis of sugar-based benzothiazoles through chemoselective intramolecular C–S coupling by Shen, Chao, Xia, Haijun, Yan, Hua, Chen, Xinzhi, Ranjit, Sadananda, Xie, Xiaoji, Tan, Davin, Lee, Richmond, Yang, Yanmei, Xing, Bengang, Huang, Kuo-Wei, Zhang, Pengfei, Liu, Xiaogang

“…Corroborated by theoretical calculations, a mechanistic investigation indicates that the coordination to the palladium by a pivaloyl carbonyl group and the presence of intramolecular hydrogen bonding play important roles in the efficiency and chemoselectivity of reaction. …”
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Acute effects of home-based online square-stepping exercise on cohesion in sedentary young adults by Goh, Gint

“…The SSE program encourages social interactions and task bonding among participants. The present study hypothesized that SSE promotes the participants’ cohesion level to a greater extent than its active control condition (ACC), aerobics. …”
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Effect of coupling agent on hollow carbon microsphere/phenolic resin syntactic foam by Chan, Sze Hua.

“…The FITR and SEM were used to scan for chemical bonds and topography of hollow carbon microsphere respectively. …”
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Integrated 3D inductors by Ong, Shi Qi

“…At present, these characteristics cannot be achieved simultaneously using conventional inductor technologies, whether they are discrete, on-chip, or in-package (e.g. using bonding-wires). This project aims to develop a new methodology for implementing inductors by embedding them within the printed circuit board (PCB). …”
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Protein interactions design. by Tay, Connie Gui Ching.

“…The aim of this project is to devise a general computational design strategy, which incorporates native residues that are involved in hydrogen bonds. In designing these interactions, we hope to accurately reproduce the residue-residue interactions, including inter-protein hydrogen bonding. …”
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Hybrid lasers and modulator on silicon in the near- and mid-infrared region by Hu, Xiaonan

“…The entire route to develop the hybrid QCL on SOI is presented, including the fabrication procedures, the Au-Au bonded device with designed wafer, plasma assisted wafer bonding technique and finally the hybrid QCL device. …”
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Synthesis of heavy cyanide analogs for the design of novel Prussian blue analogs by Yang, E

“…The synthesis, characterization, and bonding of the oligomers and their monomer precursors are discussed herein. …”

Bioinspired hierarchical composites by Kathirvel Periasamy

“…Tannic acid, a polyphenol sourced from plants, was chosen as the crosslinker due to its hydrophobic interactions and hydrogen bonding with gelatin. We crosslinked gelatin with tannic acid to achieve the self-healing property and added calcium phosphate (CaP) microplatelets to the polymer matrix. …”
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Atomic transistors beyond Moore's law by Li, Haifeng

“…Experimental methods include mechanical stripping, PDMS all-dry transfer method, wire bonding, etc. The electrical characteristics of BP-based FETs are characterized by measuring their current-voltage (IV) characteristics with packaged chip carriers and test boxes. …”
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Stronger dielectric-elastomer grippers using spine-like bending structure by Heng, Kim Rui

“…This spine-like structure of high stiffness curls longitudinally upon bonding with a pre-stretched dielectric elastomeric actuator membrane. …”
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Ratiometric fluorescence detection of ferric ion based on the nanohybrid of graphene quantum dots and semiconducting polymer nanoparticle by Liang, Chenxi

“…The interaction between functional groups attached to the surface such as amine and carboxyl groups happens because of electrostatic attraction and hydrogen bonding. The ratiometric fluorescence sensor system exhibits double pronounced emission peaks at 540 and 680 nm under the excitation wavelength of 470 nm and can be used for sensitive detection of ferric ions. …”
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Fundamentals of Manufacturing Engineering : Concepts and Applications / by Singh, D. K., author 240337

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Post-polymerisation modification of surface chemical functionality and its effect on protein binding by Choong, Cleo Swee Neo, Griffiths, Jon-Paul, Luo, Baiwen, Bora, Meghali, Foord, J. S., Parker, Emily M., Moloney, Mark G.

“…Derivatisation of polystyrene by carbene insertions followed by diazonium coupling permits the introduction of diverse chemical functionality, providing access to materials with similar bulk properties, but in which surface chemical characteristics are systematically varied across a range of surface polarity, hydration and non-bonding interaction behaviour. Protein binding experiments with bovine serum albumin demonstrate that protein adhesion is dependent upon the identity of the surface chemical group, with tert-butyl, hexyl, dimethylamino, amino, and carboxyl modified systems all exhibiting higher levels of binding, while glycol, hydroxyl, and phosphonate give similar or lower levels of binding, relative to the control. …”
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Water‐binding‐mediated gelation/crystallization and thermosensitive superchirality by Xing, Pengyao, Li, Yongxin, Wang, Yang, Li, Pei-Zhou, Chen, Hongzhong, Phua, Fiona Soo Zeng, Zhao, Yanli

“…Ordered water molecules entrapped in self‐assembly arrays revealed by crystal structures behave as hydrogen‐bonding linkers to facilitate three‐dimensional growth into crystals rather than one‐dimensional gel nanofibers. …”
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Injection Compression Molding (ICM) process development for the warpage and stress reduction on polymeric microfluidic chip applications by Ler, Wan Him

“…However, the requirement of the blank chip is to have low warpage and thickness variation so that good bonding can be formed with the channel chip. By using the Moldflow simulation software, this report will be focused on simulating a large format blank cover chip that will be able to be machined into the dimensions of the channel chip used. …”
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Ferromagnetic copper-doped ZnO for spintronics by Herng, Tun Seng

“…The incorporation of N increases the substitution of high spin state of Cu2+ concentration into Zn2+ sites and stabilizes the highly diffusive Zni through N-Zn bonding. The flexible ZnO:Cu on plastic substrate and ZnO:Cu nanoneedles have been demonstrated. …”
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Density functional studies relevant to methanol steam reforming by Li, Xiang

“…Generally, only COOH and HCOOH adsorption are affected compared to other intermediates due to hydrogen bonding. For the kinetics studies on formaldehyde steam reforming, we found that the dominant process on Ir (100) is the dehydrogenation of formaldehyde. …”
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