Showing 41 - 60 results of 773 for search '("borne's" OR "bond's")', query time: 0.07s Refine Results
  1. 41

    Investigation of low temperature wafer bonding using intermediate layer by Deng, Shusheng

    Published 2008
    “…In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).…”
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    Thesis
  2. 42

    Permanent polymer bonding for MEMS device fabrication and packaging applications by Lim, Eugene KaiSheng.

    Published 2013
    “…Wafers were bonded with both patterned BCB and blanket BCB. …”
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    Final Year Project (FYP)
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    Oxidation of a P-C Bond under Mild Conditions by Ilić, Gordana, Gaguly, Rakesh, Petković, Milena, Vidović, Dragoslav

    Published 2016
    “…This compound was then identified as an analogue of the elusive Criegee intermediate as it underwent oxygen insertion into the P[BOND]C bond through a mechanism usually observed for Baeyer–Villiger oxidations. …”
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    Journal Article
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    Social bonding among children in joint physically active play by Jefferies, M

    Published 2018
    “…However, no research has examined how children’s joint physically active play is linked with social bonding (i.e., positive emotional states and behaviours that help create, maintain, and characterise affiliation and attachment among individuals). …”
    Thesis
  7. 47

    Topography of social touching depends on emotional bonds between humans by Suvilehto, JT, Glerean, E, Dunbar, RIM, Hari, R, Nummenmaa, L

    Published 2015
    “…Nonhuman primates use social touch for maintenance and reinforcement of social structures, yet the role of social touch in human bonding in different reproductive, affiliative, and kinship-based relationships remains unresolved. …”
    Journal article
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    Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

    Published 2014
    “…Unlike other usual materials that lengthen and soften all bonds when they absorb thermal energy, water performs abnormally under heating to lengthen the O:H nonbond and shorten the H–O covalent bond through inter-oxygen Coulomb coupling [Sun et al., J. …”
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    Journal Article
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    Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

    Published 2024
    “…Previous studies have demonstrated a great potential of prestressed strengthening of structures employing iron-based shape memory alloys (Fe-SMAs). A bonded Fe-SMA strengthening solution with partial activation has been proposed. …”
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    Journal Article
  15. 55

    Computer vision approaches for automatic inspection of wire bonding of semiconductor devices by Lim, Han Ooi.

    Published 2009
    “…There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. …”
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    Thesis
  16. 56

    Bond and electronic relaxation dynamics of graphene, gold clusters, and water ice by Zhang, Xi

    Published 2013
    “…Undercoordinated atoms and nonbonding electrons exist widely in nanomaterials and in network-structural materials with their impact under-estimated. Bonds around under-coordinated sites and nonbond lone pairs follow irregular relaxation dynamic rules with the rules remaining unclear. …”
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    Thesis
  17. 57

    The real reunion : an integrated campaign to strengthen family bonds through meals. by Chen, Zhihui, Lim, Desmond Hiok Hwee, Tan, Nian Shun, Toh, Yew Zhen

    Published 2014
    “…Targeted at youth aged 18 to 25, the campaign seeks to leverage on family reunion dinner to bond families and improve parent-child relationship through meals. …”
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    Final Year Project (FYP)
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