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Showing 41 - 60 results of 1,904 for search '("done's" OR "bond's")', query time: 0.09s Refine Results
  1. 41

    Topography of social touching depends on emotional bonds between humans by Suvilehto, JT, Glerean, E, Dunbar, RIM, Hari, R, Nummenmaa, L

    Published 2015
    “…Nonhuman primates use social touch for maintenance and reinforcement of social structures, yet the role of social touch in human bonding in different reproductive, affiliative, and kinship-based relationships remains unresolved. …”
    Journal article
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    “I really need your help with this work..”: A System for Navigating the Tricky Terrain of Managing Up by Leveraging One’s Motivation to Get Things Done by Park, Soya, Vishwabhan, Stuti, Muller, Michael, Karger, David R.

    Published 2024
    “…When people need help from their supervisors or peers, they often have to manage up to get things done. However, unlike managing subordinates (managing down), managing people of equal or higher status (managing up) are not obligated to help. …”
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    Article
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    Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

    Published 2014
    “…Unlike other usual materials that lengthen and soften all bonds when they absorb thermal energy, water performs abnormally under heating to lengthen the O:H nonbond and shorten the H–O covalent bond through inter-oxygen Coulomb coupling [Sun et al., J. …”
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    Journal Article
  6. 46
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    Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

    Published 2024
    “…Previous studies have demonstrated a great potential of prestressed strengthening of structures employing iron-based shape memory alloys (Fe-SMAs). A bonded Fe-SMA strengthening solution with partial activation has been proposed. …”
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    Journal Article
  8. 48

    Computer vision approaches for automatic inspection of wire bonding of semiconductor devices by Lim, Han Ooi.

    Published 2009
    “…There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. …”
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    Thesis
  9. 49

    Bond and electronic relaxation dynamics of graphene, gold clusters, and water ice by Zhang, Xi

    Published 2013
    “…Undercoordinated atoms and nonbonding electrons exist widely in nanomaterials and in network-structural materials with their impact under-estimated. Bonds around under-coordinated sites and nonbond lone pairs follow irregular relaxation dynamic rules with the rules remaining unclear. …”
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    Thesis
  10. 50

    The real reunion : an integrated campaign to strengthen family bonds through meals. by Chen, Zhihui, Lim, Desmond Hiok Hwee, Tan, Nian Shun, Toh, Yew Zhen

    Published 2014
    “…Targeted at youth aged 18 to 25, the campaign seeks to leverage on family reunion dinner to bond families and improve parent-child relationship through meals. …”
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    Final Year Project (FYP)
  11. 51
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  14. 54

    Carbenoid-mediated N–O bond insertion and its application in the synthesis of pyridines by Qi, Xinxin, Dai, Lu, Park, Cheol-Min

    Published 2013
    “…Highly efficient synthesis of 3-hydroxypyridines has been developed based on carbenoid-mediated N–O bond insertion. Treatment of δ-diazo oxime ethers with dirhodium complex Rh2(tfacam)4 rapidly provides a variety of pyridines in 5–10 minutes in good to excellent yields.…”
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    Journal Article
  15. 55

    Divergent reactivity of phosphapalladacycles toward E-H (E = N, P, As) bonds by Tay, Wee Shan, Li, Yongxin, Pullarkat, Sumod A., Leung, Pak-Hing

    Published 2022
    “…Secondary arsines were observed to decomplex strongly chelating phosphapalladacycles rapidly under mild conditions. As-H bond migration led to ortho-protonation of the C,P ligand. …”
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    Journal Article
  16. 56

    Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

    Published 2023
    “…However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. …”
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    Journal Article
  17. 57

    Balancing degradability and mechanical strength in keto modified polyethylene through hydrogen bonds by Li, Ke, Chen, Xi, Pan, Yuqing, Min, Benzhi, Ye, Enyi, Li, Shuzhou, Li, Zibiao, Loh, Xian Jun

    Published 2024
    “…This study shows that hydrogen bonding plays a compensatory role in KMPE by mitigating the reduction in mechanical properties due to keto group addition, effectively counterbalancing structural alterations to maintain mechanical integrity. …”
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    Journal Article
  18. 58

    Ultrsonic testing of bond integrity in adhesive joints between 2 similar metals by Ang, Marcus

    Published 2017
    “…However, this technique is insufficient in determining the bond quality of the adhesive from the results obtained. …”
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    Final Year Project (FYP)
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