Showing 61 - 80 results of 814 for search '(("stoning" OR "sboning") OR ("toning" OR ("bonding" OR "brownian")))', query time: 0.14s Refine Results
  1. 61

    Investigating rhodium-catalysed hydroacylation and carbon-carbon bond activation by Coxon, T

    Published 2017
    Subjects: “…C-C Bond Activation…”
    Thesis
  2. 62

    Topography of social touching depends on emotional bonds between humans by Suvilehto, JT, Glerean, E, Dunbar, RIM, Hari, R, Nummenmaa, L

    Published 2015
    “…Nonhuman primates use social touch for maintenance and reinforcement of social structures, yet the role of social touch in human bonding in different reproductive, affiliative, and kinship-based relationships remains unresolved. …”
    Journal article
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  8. 68

    Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

    Published 2014
    “…Unlike other usual materials that lengthen and soften all bonds when they absorb thermal energy, water performs abnormally under heating to lengthen the O:H nonbond and shorten the H–O covalent bond through inter-oxygen Coulomb coupling [Sun et al., J. …”
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    Journal Article
  9. 69
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    Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

    Published 2024
    “…Previous studies have demonstrated a great potential of prestressed strengthening of structures employing iron-based shape memory alloys (Fe-SMAs). A bonded Fe-SMA strengthening solution with partial activation has been proposed. …”
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    Journal Article
  11. 71

    Computer vision approaches for automatic inspection of wire bonding of semiconductor devices by Lim, Han Ooi.

    Published 2009
    “…There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. …”
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    Thesis
  12. 72

    Bond and electronic relaxation dynamics of graphene, gold clusters, and water ice by Zhang, Xi

    Published 2013
    “…The hidden force opposing H2O compression behind the repulsion between nonbonding lone pair and bonding pair of hydrogen bond was revealed by theoretical analysis and molecular dynamics (MD) and ab initio MD calculations: i) the compression shortens and strengthens the intermolecular ‘‘O2- : H+/p’’ lone-pair and stretching phonons (<400 cm-1) are thus stiffened; ii) the repulsion pushes the bonding electron pair away from the H+/p and hence elongates and weakens the ‘‘H+/p–O2-” bond, making stretching phonons (>3000 cm-1) softened upon compression. …”
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    Thesis
  13. 73

    The real reunion : an integrated campaign to strengthen family bonds through meals. by Chen, Zhihui, Lim, Desmond Hiok Hwee, Tan, Nian Shun, Toh, Yew Zhen

    Published 2014
    “…Targeted at youth aged 18 to 25, the campaign seeks to leverage on family reunion dinner to bond families and improve parent-child relationship through meals. …”
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    Final Year Project (FYP)
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  17. 77

    Carbenoid-mediated N–O bond insertion and its application in the synthesis of pyridines by Qi, Xinxin, Dai, Lu, Park, Cheol-Min

    Published 2013
    “…Highly efficient synthesis of 3-hydroxypyridines has been developed based on carbenoid-mediated N–O bond insertion. Treatment of δ-diazo oxime ethers with dirhodium complex Rh2(tfacam)4 rapidly provides a variety of pyridines in 5–10 minutes in good to excellent yields.…”
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    Journal Article
  18. 78

    Divergent reactivity of phosphapalladacycles toward E-H (E = N, P, As) bonds by Tay, Wee Shan, Li, Yongxin, Pullarkat, Sumod A., Leung, Pak-Hing

    Published 2022
    “…Secondary arsines were observed to decomplex strongly chelating phosphapalladacycles rapidly under mild conditions. As-H bond migration led to ortho-protonation of the C,P ligand. …”
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    Journal Article
  19. 79

    Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

    Published 2023
    “…However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. …”
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    Journal Article
  20. 80

    Balancing degradability and mechanical strength in keto modified polyethylene through hydrogen bonds by Li, Ke, Chen, Xi, Pan, Yuqing, Min, Benzhi, Ye, Enyi, Li, Shuzhou, Li, Zibiao, Loh, Xian Jun

    Published 2024
    “…This study shows that hydrogen bonding plays a compensatory role in KMPE by mitigating the reduction in mechanical properties due to keto group addition, effectively counterbalancing structural alterations to maintain mechanical integrity. …”
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    Journal Article