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Solder joint testing and failure analysis
Published 2012“…These devices are also likely to undergo thermo-mechanical cycling during device processing and service and therefore, the joints are likely to have existing low-cycle fatigue cracks, which might adversely affect the joint mechanical integrity under various loading situations. …”
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Final Year Project (FYP) -
183
Long-term re-identification
Published 2023“…For Long-Term Re-ID, the Re-ID models must be insensitive to the subject’s clothing as we assume that changing of clothes are likely to occur. Recently, a long-term Re-ID model, called SPS, with a result almost double its predecessor was shared. …”
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Final Year Project (FYP) -
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Modeling of thermal behavior in phase change interconnects
Published 2010Get full text
Final Year Project (FYP) -
195
Improved effective channel length extraction method for 0.09-0.13 mm CMOS
Published 2008Get full text
Thesis -
196
Learning and exploiting context dependencies for robust recommendations
Published 2010Get full text
Thesis -
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Automatic modulation classification of higher order QAM signals
Published 2011Get full text
Final Year Project (FYP)