Showing 141 - 160 results of 3,084 for search '((((hone OR phone) OR (pore OR (bond OR band))) OR born) OR soon)'s', query time: 0.20s Refine Results
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    Service quality in the Singapore mobile phone industry after 1 April 2000 : the consumer's perspective. by Phua, Kevin Tshi Howe., Koh, Kok Beng., Goh, Jayson Chor Hong.

    Published 2008
    “…Provides a more customer-focused analysis of the service quality in the Singapore mobile phone industry after full liberalisation on April 1, 2000 using the SERVQUAL Model. …”
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    Final Year Project (FYP)
  3. 143

    An Analysis of the Effect of Price and Quality on Customer Buying Patterns: An Empirical Study of iPhone Buyers by Hamizan, Maisarah, Abu, Noor Hidayah, Mansor, Mohd Fitri, Zaidi, Mohd Azian

    Published 2023
    “…Apple is the most valuable firm in the world, the fourth-largest vendor of personal computers by unit sales, and the second-largest producer of mobile phones as of May 2022. The iPhone is a product with a strong reputation. …”
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    Article
  4. 144

    Bond and electronic relaxation dynamics of graphene, gold clusters, and water ice by Zhang, Xi

    Published 2013
    “…Size-dependent surface bond contraction, potential well depression, electron and energy entrapment and valence band polarization of Au nanoclusters and nanocages were also verified by DFT calculations and BOLS-TB analysis. …”
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    Thesis
  5. 145
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    Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

    Published 2014
    “…Unlike other usual materials that lengthen and soften all bonds when they absorb thermal energy, water performs abnormally under heating to lengthen the O:H nonbond and shorten the H–O covalent bond through inter-oxygen Coulomb coupling [Sun et al., J. …”
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    Journal Article
  8. 148
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    Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

    Published 2024
    “…Previous studies have demonstrated a great potential of prestressed strengthening of structures employing iron-based shape memory alloys (Fe-SMAs). A bonded Fe-SMA strengthening solution with partial activation has been proposed. …”
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    Journal Article
  10. 150

    Computer vision approaches for automatic inspection of wire bonding of semiconductor devices by Lim, Han Ooi.

    Published 2009
    “…There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. …”
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    Thesis
  11. 151

    The real reunion : an integrated campaign to strengthen family bonds through meals. by Chen, Zhihui, Lim, Desmond Hiok Hwee, Tan, Nian Shun, Toh, Yew Zhen

    Published 2014
    “…Targeted at youth aged 18 to 25, the campaign seeks to leverage on family reunion dinner to bond families and improve parent-child relationship through meals. …”
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    Final Year Project (FYP)
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  16. 156

    Pressure-Dependent Polymorphism and Band-Gap Tuning of Methylammonium Lead Iodide Perovskite by Jiang, Shaojie, Fang, Yanan, Li, Ruipeng, Xiao, Hai, Crowley, Jason, Wang, Chenyu, White, Timothy John, Goddard III, William A., Wang, Zhongwu, Baikie, Tom, Fang, Jiye

    Published 2017
    “…In situ pressure photoluminescence investigation suggests a reduction in band gap with increasing pressure up to ≈0.3 GPa and then an increase in band gap up to a pressure of 2.7 GPa, in excellent agreement with our DFT calculation prediction. …”
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    Journal Article
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