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    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. On the other hand, for horizontal LED (light emitting diode), like TO-92, the market price is as cheap as only US 1 cent due to the intensive commercial competition. …”
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    WHEN WE CEASE TO UNDERSTAND THE WORLD / by Labatut, Benjamin, author 655068

    Published 2020
    “…Some of their discoveries revolutionise our world for the better; others pave the way to chaos and unimaginable suffering. …”
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