Showing 881 - 900 results of 1,807 for search '((((pina OR (bina OR bing)) OR ping) OR fine) OR ((ainaa OR (sspinna OR pingao)) OR pin))', query time: 0.20s Refine Results
  1. 881

    Bi-factorial preference optimization: balancing safety-helpfulness in language models by Zhang, W, Torr, PHS, Elhoseiny, M, Bibi, A

    Published 2025
    “…Fine-tuning large language models (LLMs) on human preferences, typically through reinforcement learning from human feedback (RLHF), has proven successful in enhancing their capabilities. …”
    Conference item
  2. 882

    Analog smart I/O pads by Tan, Shyue Mei.

    Published 2009
    “…ESD is an increasingly significant problem in integrated circuit design as increasing pin counts and faster circuit speeds compound the need for more and better reliable ESD protection. …”
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    Final Year Project (FYP)
  3. 883

    Effect of emulsion temperature on physical properties of palm oil‐based margarine by Miskandar, M. S., Che Man, Y. B., Yusoff, M. S. A., Abdul Rahman, R.

    Published 2002
    “…The emulsion temperatures studied were 40, 45, and 50°C, with other parameters such as emulsion flow rates, tube cooler temperature, and pin rotor speed kept constant. The SFC developed during processing and storage at 28°C was measured to evaluate the quality of margarine. …”
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    Article
  4. 884
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  8. 888

    A physical model for sloping capillary barriers by Rahardjo, Harianto, Tami, Denny, Leong, Eng Choon, Fredlund, Delwyn G.

    Published 2011
    “…A sloping two-layer capillary barrier model consisting of a relatively fine soil layer over a relatively coarse soil layer was constructed inside a specially designed apparatus. …”
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    Journal Article
  9. 889

    Anomaly detection in aerosol jet printing via computer vision & machine learning by Ang, Ryan Wei Hao

    Published 2023
    “…The Aerosol Jet Printing (AJP) technique is a relatively new contactless direct write method that is being developed for the purpose of producing fine features on a diverse selection of surfaces. …”
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    Final Year Project (FYP)
  10. 890

    Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

    Published 2008
    “…Field applications using existing packaging infrastructure has demonstrated the robustness of applying the SLICF bonding with the joint-in-via architecture for fine pitch flip-chip applications.…”
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    Thesis
  11. 891

    Lattice code design for the Rayleigh fading wiretap channel by Belfiore, Jean-Claude, Oggier, Frederique

    Published 2011
    “…We present a design criterion for both the fine and coarse lattice to obtain wire tap lattice codes for the Rayleigh fading Wiretap Channel.…”
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    Conference Paper
  12. 892
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  16. 896

    Video summarization by Cheong, Shao Qiang.

    Published 2011
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    Final Year Project (FYP)
  17. 897
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  20. 900

    Acid FYP report by Woo, Bao Xin

    Published 2018
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    Final Year Project (FYP)