Showing 441 - 460 results of 3,422 for search '((((pina OR (ming OR bina)) OR shinae) OR spine) OR ((lines OR esling) OR link))', query time: 0.17s Refine Results
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
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    Measurement and calibration of a six-axis reconfigurable parallel robot system by Chen, I-Ming., Yeo, Song Huat.

    Published 2008
    “…A modular reconfigurable parallel robot system consists of standardized links and joint components that can be assembled into a particular geometry for specific tasks. …”
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    Research Report
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