Search alternatives:
pingaa » pingat (Expand Search), pingao (Expand Search), pingata (Expand Search), pingaoa (Expand Search), pinga (Expand Search), pinggaa (Expand Search), spingaa (Expand Search)
pingna » pinna (Expand Search), pinggna (Expand Search), spingna (Expand Search)
pina » ping (Expand Search), bina (Expand Search), aina (Expand Search), pinga (Expand Search), spina (Expand Search)
pinga » pingat (Expand Search), pingao (Expand Search), ping (Expand Search), pingga (Expand Search), spinga (Expand Search)
fine » line (Expand Search), five (Expand Search)
spie » spin (Expand Search)
ssspinge » ssspingge (Expand Search), sssspinge (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
pingaa » pingat (Expand Search), pingao (Expand Search), pingata (Expand Search), pingaoa (Expand Search), pinga (Expand Search), pinggaa (Expand Search), spingaa (Expand Search)
pingna » pinna (Expand Search), pinggna (Expand Search), spingna (Expand Search)
pina » ping (Expand Search), bina (Expand Search), aina (Expand Search), pinga (Expand Search), spina (Expand Search)
pinga » pingat (Expand Search), pingao (Expand Search), ping (Expand Search), pingga (Expand Search), spinga (Expand Search)
fine » line (Expand Search), five (Expand Search)
spie » spin (Expand Search)
ssspinge » ssspingge (Expand Search), sssspinge (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
-
821
-
822
Development of indexing clamper mechanism for wire bonder
Published 2008“…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
Get full text
Thesis -
823
-
824
Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
Published 2008“…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
Get full text
Thesis -
825
Enhancing sentiment analysis on social media data
Published 2016“…This report explains my extensive research on the engine’s improvement from the following three perspectives: Fine-grained analysis of the sentiment including specific emotions, associate the sentiment with the topics and compute a domain-specific word’s polarity. …”
Get full text
Final Year Project (FYP) -
826
-
827
-
828
-
829
-
830
-
831
-
832
-
833
-
834
-
835
AutoAD III: the prequel – back to the pixels
Published 2024“…Generating Audio Description (AD) for movies is a challenging task that requires fine-grained visual understanding and an awareness of the characters and their names. …”
Conference item -
836
Feasibility study : setting up an independent service provider in the elevator industry.
Published 2008“…The project aims to find out what consumers in the elevator industry perceive service quality to be.…”
Get full text
Final Year Project (FYP) -
837
Experimenting on weighted PCA on Yale face database
Published 2008“…The main idea is to find the principal components of the distribution of faces or the eigenvectors of the covariance matrix of the set of training images.…”
Get full text
Thesis -
838
Impact of merchandise display on consumer behaviour.
Published 2008“…The aim of our study is to find out the effects of combination of casual wear on consumers' perception of targetted T-shirt.…”
Get full text
Final Year Project (FYP) -
839
Legal case analysis : failures in it outsourcing contracts.
Published 2008“…This project seeks to find out the reasons behind the failure of IT outsourcing contracts.…”
Get full text
Final Year Project (FYP) -
840
Fashion artifice
Published 2023“…Finally, the project explores ways to present findings and ideas in an experimental editorial design outcome. …”
Get full text
Final Year Project (FYP)