Showing 121 - 140 results of 562 for search '((((pink OR spink) OR (spink OR sspink)) OR qingge) OR (((spie OR owing) OR pinna) OR pin))', query time: 0.16s Refine Results
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    Organic donor-acceptor cocrystals for multiferroic applications by Wang, Zongrui, Zhang, Qichun

    Published 2021
    “…The cocrystallization strategy has provided an efficient route to fulfill room temperature magnetoelectricity in single phase owing to the long-range ordered π-π stacking (donor-acceptor assembled) network, long-lived excitons (with μs lifetime), spin orders (±1/2 s pin) and charge transfer (CT) dipoles in the assembled crystal lattice. …”
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    Journal Article
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    Robust text-independent speaker verification in environmental noise by Panda, Ashish

    Published 2011
    “…Experimental evaluations of the proposed psychoacoustic model compensation technique conclusively demonstrate that it provides superior performance in both white and pink noise conditions, outperforming parallel model combination by 36% and max function based model compensation by 24%. …”
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    Thesis
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    Convective boiling and condensation in enhanced tubes produced by selective laser melting by Tan, Choon Yong

    Published 2018
    “…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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    Final Year Project (FYP)
  18. 138

    Using edge detection and polarimetric imaging for vaccine inspection by Sharan, Praveer, Tellbach, Denise, Sarma, Sanjay E.

    Published 2024
    “…SPIE Smart Structures + Nondestructive Evaluation, 2022, Long Beach, California, United States…”
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    Article
  19. 139

    A two-dimensional co-rotational Timoshenko beam element with XFEM formulation by Xu, Jin, Lee, Chi King, Tan, Kang Hai

    Published 2014
    “…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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    Journal Article
  20. 140

    Study of heat transfer through micro-structured surfaces by Chin, Wei Hao

    Published 2016
    “…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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    Final Year Project (FYP)