Optimizing Android smartphone’s user experience and power efficiency through governor and scheduler customization by Koh, Nicholas Ming Xuan

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Ce yin zhi xin in the Mencius : being concerned for the other by Han, Joey Ming Jie

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Investigating accuracy of contour interpolation in modal and amodal completion by Koh, Nicklaus Zhi-Ming

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Scratch based graphical programming online guide/exam system by Chan, Bryan Hong Ming

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Degradation of plastic waste due to wave action by Hng, Samuel Gei Ming

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Keyword and named entity recognition on air traffic control (ATC) data by Thia, Jeremy Ming Xuan

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An on-skin electrode with anti-epidermal-surface-lipid function based on a zwitterionic polymer brush by He, Ke, Liu, Zhiyuan, Wan, Changjin, Jiang, Ying, Wang, Ting, Wang, Ming, Zhang, Feilong, Liu, Yaqing, Pan, Liang, Xiao, Meng, Yang, Hui, Chen, Xiaodong

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Recent development in halogen-bonding-catalyzed living radical polymerization by Wang, Chen-Gang, Chong, Amerlyn Ming Liing, Pan, Matthew Houwen, Sarkar, Jit, Tay, Xiu Ting, Goto, Atsushi

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Programmable bandwidth-variable optical temporal differentiator based on linearly chirped fiber bragg grating and digital thermal controller by Wang, Ruoxu, Tang, Ming, Zhang, Hailiang, Feng, Zhenhua, Lin, Rui, Fu, Songnian, Liu, Deming, Shum, Perry Ping

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Are adenine strands helical H-aggregates? by Hu, Lihong, Zhao, Yang, Wang, Fan, Chen, Guan Hua, Ma, Chensheng, Kwok, Wai Ming, David Lee Phillips

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Hiring the right accountants. by Lim, Eric Ming Wei., See, Sean Ming Seng., Sek, Paul Yu Lim.

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Understanding organic solvent permeation during nanofiltration via electrical impedance spectroscopy (EIS) by Ng, Angie Qi Qi, Tanudjaja, Henry Jonathan, Yeo, Ming Ming, Chew, Jia Wei

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3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

“…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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Entanglement in smart hydrogels: fast response time, anti-freezing and anti-drying by Feng, Yuqin, Wang, Shancheng, Li, Yaqin, Ma, Wenxia, Zhang, Gang, Yang, Ming, Li, Haibo, Yang, Yongsheng, Long, Yi

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Experimental study on mix proportion and fresh properties of fly ash based geopolymer for 3D concrete printing by Panda, Biranchi, Tan, Ming Jen

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Cyberporn and censorship. by Lui, Chee Ming., Yeo, Benjamin.

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Bio-modification of sand for cement grouting by Ng, Samuel Joel Rui Ming

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Degradation model of a linear-mode LED driver and its application in lifetime prediction by Lan, Song, Tan, Cher Ming

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Localization and velocity tracking of human via 3 IMU sensors by Yuan, Qilong, Chen, I-Ming

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Fiber crossbars: an emerging architecture of smart electronic textiles by Zhou, Xuhui, Wang, Zhe, Xiong, Ting, He, Bing, Wang, Zhixun, Zhang, Haozhe, Hu, Dongmei, Liu, Yanting, Yang, Chunlei, Li, Qingwen, Chen, Ming, Zhang, Qichong, Wei, Lei

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